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Research Output 2006 2019

  • 158 Citations
  • 6 h-Index
  • 17 Conference contribution
  • 8 Article
  • 1 Review article
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Article
2019
1 Citation (Scopus)

Four questions in cellular material design

Bhate, D., Jan 1 2019, In : Materials. 12, 7, 1060.

Research output: Contribution to journalArticle

Open Access
3D printers
Software design
Foams
2013
6 Citations (Scopus)

Constitutive models for intermediate-and high-strain rate flow behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu solder alloys

Chan, D., Nie, X., Bhate, D., Subbarayan, G., Chen, W. W. & Dutta, I., Jan 21 2013, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 3, 1, p. 133-146 14 p., 6381477.

Research output: Contribution to journalArticle

Constitutive models
Soldering alloys
Strain rate
Plastic flow
Failure modes
2012
6 Citations (Scopus)

An information theoretic argument on the form of damage accumulation in solids

Bhate, D., Mysore, K. & Subbarayan, G., Jan 1 2012, In : Mechanics of Advanced Materials and Structures. 19, 1-3, p. 184-195 12 p.

Research output: Contribution to journalArticle

Damage Accumulation
Cracks
Dissipation
Statistical mechanics
Fatigue testing
2010
3 Citations (Scopus)

Singularities at solder joint Interfaces and their effects on Fracture models

Bhate, D., Chan, D., Subbarayan, G., Nguyen, L., Zhao, J. & Edwards, D., Jun 1 2010, In : Journal of Electronic Packaging, Transactions of the ASME. 132, 2, p. 210071-2100710 1890640 p.

Research output: Contribution to journalArticle

Soldering alloys
Crack propagation
Chip scale packages
Thermal cycling
Fracture mechanics
2009

Improved solder joint fatigue models through reduced geometry dependence of empirical fits

Bhate, D., Subbarayan, G., Zhao, J., Gupta, V. & Edwards, D., Dec 1 2009, In : Journal of Electronic Packaging, Transactions of the ASME. 131, 4, p. 445021-445023 3 p.

Research output: Contribution to journalArticle

Soldering alloys
Fatigue of materials
Geometry
Constitutive models
Microelectronics
2008
9 Citations (Scopus)

A nonlinear fracture mechanics approach to modeling fatigue crack growth in solder joints

Bhate, D., Chan, D., Subbarayan, G. & Nguyen, L., Jun 1 2008, In : Journal of Electronic Packaging, Transactions of the ASME. 130, 2, p. 210031-210039 9 p.

Research output: Contribution to journalArticle

Fatigue crack propagation
Fracture mechanics
Soldering alloys
Fatigue of materials
Trajectories
73 Citations (Scopus)

Constitutive behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu alloys at creep and low strain rate regimes

Bhate, D., Chan, D., Subbarayan, G., Chiu, T. C., Gupta, V. & Edwards, D. R., Oct 9 2008, In : IEEE Transactions on Components and Packaging Technologies. 31, 3, p. 622-633 12 p.

Research output: Contribution to journalArticle

Soldering alloys
Strain rate
Creep
Constitutive models
Hardening
2007
3 Citations (Scopus)

Adhesion of arbitrary-shaped thin-film microstructures

Bhate, D. & Dunn, M. L., Dec 1 2007, In : Microelectronics Reliability. 47, 12, p. 2014-2024 11 p.

Research output: Contribution to journalArticle

circular plates
adhesion
Adhesion
Thin films
microstructure