Dhruv Bhate

Assoc Professor

  • 197 Citations
  • 7 h-Index
20062019

Research output per year

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Research Output

  • 197 Citations
  • 7 h-Index
  • 17 Conference contribution
  • 8 Article
  • 1 Comment/debate
  • 1 Review article
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Article
2019

Four questions in cellular material design

Bhate, D., Jan 1 2019, In : Materials. 12, 7, 1060.

Research output: Contribution to journalArticle

Open Access
5 Scopus citations
2013

Constitutive models for intermediate-and high-strain rate flow behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu solder alloys

Chan, D., Nie, X., Bhate, D., Subbarayan, G., Chen, W. W. & Dutta, I., Jan 21 2013, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 3, 1, p. 133-146 14 p., 6381477.

Research output: Contribution to journalArticle

7 Scopus citations
2012

An information theoretic argument on the form of damage accumulation in solids

Bhate, D., Mysore, K. & Subbarayan, G., Jan 1 2012, In : Mechanics of Advanced Materials and Structures. 19, 1-3, p. 184-195 12 p.

Research output: Contribution to journalArticle

6 Scopus citations
2010

Singularities at solder joint Interfaces and their effects on Fracture models

Bhate, D., Chan, D., Subbarayan, G., Nguyen, L., Zhao, J. & Edwards, D., Jun 1 2010, In : Journal of Electronic Packaging, Transactions of the ASME. 132, 2, p. 210071-2100710 1890640 p.

Research output: Contribution to journalArticle

3 Scopus citations
2009

Improved solder joint fatigue models through reduced geometry dependence of empirical fits

Bhate, D., Subbarayan, G., Zhao, J., Gupta, V. & Edwards, D., Dec 1 2009, In : Journal of Electronic Packaging, Transactions of the ASME. 131, 4, p. 445021-445023 3 p.

Research output: Contribution to journalArticle

2008

A nonlinear fracture mechanics approach to modeling fatigue crack growth in solder joints

Bhate, D., Chan, D., Subbarayan, G. & Nguyen, L., Jun 1 2008, In : Journal of Electronic Packaging, Transactions of the ASME. 130, 2, p. 210031-210039 9 p.

Research output: Contribution to journalArticle

11 Scopus citations

Constitutive behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu alloys at creep and low strain rate regimes

Bhate, D., Chan, D., Subbarayan, G., Chiu, T. C., Gupta, V. & Edwards, D. R., Oct 9 2008, In : IEEE Transactions on Components and Packaging Technologies. 31, 3, p. 622-633 12 p.

Research output: Contribution to journalArticle

77 Scopus citations
2007

Adhesion of arbitrary-shaped thin-film microstructures

Bhate, D. & Dunn, M. L., Dec 1 2007, In : Microelectronics Reliability. 47, 12, p. 2014-2024 11 p.

Research output: Contribution to journalArticle

3 Scopus citations