Dhruv Bhate

Assoc Professor

  • 165 Citations
  • 7 h-Index
20062021
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Research Output 2006 2019

  • 165 Citations
  • 7 h-Index
  • 17 Conference contribution
  • 8 Article
  • 1 Review article
2019
7 Citations (Scopus)

Beautiful and Functional: A Review of Biomimetic Design in Additive Manufacturing

du Plessis, A., Broeckhoven, C., Yadroitsava, I., Yadroitsev, I., Hands, C. H., Kunju, R. & Bhate, D., May 1 2019, In : Additive Manufacturing. 27, p. 408-427 20 p.

Research output: Contribution to journalReview article

3D printers
Biomimetics
Medical applications
Mechanical engineering
Sports
1 Citation (Scopus)

Four questions in cellular material design

Bhate, D., Jan 1 2019, In : Materials. 12, 7, 1060.

Research output: Contribution to journalArticle

Open Access
3D printers
Software design
Foams
2018

Quasi-static and dynamic behavior of additively manufactured metallic lattice cylinders

Sadeghi, H., Bhate, D., Abraham, J. & Magallanes, J., Jul 3 2018, Shock Compression of Condensed Matter - 2017: Proceedings of the Conference of the American Physical Society Topical Group on Shock Compression of Condensed Matter. Knudson, M. D., Brown, E. N., Chau, R., Germann, T. C., Lane, J. M. D. & Eggert, J. H. (eds.). American Institute of Physics Inc., Vol. 1979. 070029

Research output: Chapter in Book/Report/Conference proceedingConference contribution

strain rate
hollow
hardening
stainless steels
dynamic loads
2013
6 Citations (Scopus)

Constitutive models for intermediate-and high-strain rate flow behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu solder alloys

Chan, D., Nie, X., Bhate, D., Subbarayan, G., Chen, W. W. & Dutta, I., Jan 21 2013, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 3, 1, p. 133-146 14 p., 6381477.

Research output: Contribution to journalArticle

Constitutive models
Soldering alloys
Strain rate
Plastic flow
Failure modes
2012
6 Citations (Scopus)

An information theoretic argument on the form of damage accumulation in solids

Bhate, D., Mysore, K. & Subbarayan, G., Jan 1 2012, In : Mechanics of Advanced Materials and Structures. 19, 1-3, p. 184-195 12 p.

Research output: Contribution to journalArticle

Damage Accumulation
Cracks
Dissipation
Statistical mechanics
Fatigue testing
2010
1 Citation (Scopus)

A multiscale damage accumulation theory for solder joint failure

Bhate, D., Mysore, K. & Subbarayan, G., Jun 30 2010, Proceedings of the ASME InterPack Conference 2009, IPACK2009. Vol. 2. p. 191-197 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Information theory
Thermodynamics
Microstructure
Plasticity
1 Citation (Scopus)

Characterization of crack fronts in a WLCSP package: Experiments and models for application of a multiscale fracture theory

Chan, D., Bhate, D., Subbarayan, G. & Nguyen, L., Jun 30 2010, Proceedings of the ASME InterPack Conference 2009, IPACK2009. Vol. 2. p. 199-205 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Cracks
Soldering alloys
Experiments
Failure analysis
Chip scale packages
7 Citations (Scopus)

High strain rate behavior of Sn3.8Ag0.7Cu solder alloys and its influence on the fracture location within solder joints

Chan, D., Nie, X., Bhate, D., Subbarayan, G. & Dutta, I., Jun 25 2010, Proceedings of the ASME InterPack Conference 2009, IPACK2009. Vol. 1. p. 989-995 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Strain rate
Intermetallics
Failure modes
Data acquisition

Predicting crack growth and fatigue lives of QFN solder joints using a multiscale fracture model

Chan, D., Bhate, D., Subbarayan, G., Zhao, J. & Edwards, D., Jun 30 2010, Proceedings of the ASME InterPack Conference 2009, IPACK2009. Vol. 2. p. 207-213 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Crack propagation
Lead
Fatigue of materials
Geometry
3 Citations (Scopus)

Singularities at solder joint Interfaces and their effects on Fracture models

Bhate, D., Chan, D., Subbarayan, G., Nguyen, L., Zhao, J. & Edwards, D., Jun 1 2010, In : Journal of Electronic Packaging, Transactions of the ASME. 132, 2, p. 210071-2100710 1890640 p.

Research output: Contribution to journalArticle

Soldering alloys
Crack propagation
Chip scale packages
Thermal cycling
Fracture mechanics
2009

Improved solder joint fatigue models through reduced geometry dependence of empirical fits

Bhate, D., Subbarayan, G., Zhao, J., Gupta, V. & Edwards, D., Dec 1 2009, In : Journal of Electronic Packaging, Transactions of the ASME. 131, 4, p. 445021-445023 3 p.

Research output: Contribution to journalArticle

Soldering alloys
Fatigue of materials
Geometry
Constitutive models
Microelectronics
2008
8 Citations (Scopus)

Aging-informed behavior of Sn3.8Ag0.7Cu solder alloys

Mysore, K., Chan, D., Bhate, D., Subbarayan, G., Dutta, I., Gupta, V., Zhao, J. & Edwards, D., Sep 9 2008, 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM. p. 870-875 6 p. 4544357

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Aging of materials
Constitutive models
Creep
Microstructure
9 Citations (Scopus)

A nonlinear fracture mechanics approach to modeling fatigue crack growth in solder joints

Bhate, D., Chan, D., Subbarayan, G. & Nguyen, L., Jun 1 2008, In : Journal of Electronic Packaging, Transactions of the ASME. 130, 2, p. 210031-210039 9 p.

Research output: Contribution to journalArticle

Fatigue crack propagation
Fracture mechanics
Soldering alloys
Fatigue of materials
Trajectories
74 Citations (Scopus)

Constitutive behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu alloys at creep and low strain rate regimes

Bhate, D., Chan, D., Subbarayan, G., Chiu, T. C., Gupta, V. & Edwards, D. R., Oct 9 2008, In : IEEE Transactions on Components and Packaging Technologies. 31, 3, p. 622-633 12 p.

Research output: Contribution to journalArticle

Soldering alloys
Strain rate
Creep
Constitutive models
Hardening
3 Citations (Scopus)

Constitutive behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu alloys at creep and low strain rate regimes

Bhate, D., Chan, D., Subbarayan, G., Chiu, T. C., Edwards, D. & Gupta, V., May 28 2008, Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007. Vol. 5. p. 183-196 14 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Strain rate
Creep
Constitutive models
Hardening
7 Citations (Scopus)

Rate-dependent behavior of Sn3.8Ag0.7Cu solder over strain rates of 10 -6 to 102 s-1

Nie, X., Bhate, D., Chan, D., Chen, W., Subbarayan, G. & Dutta, I., Sep 9 2008, 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM. p. 676-682 7 p. 4544333

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Strain rate
Constitutive models
Fatigue of materials
Yield stress
2 Citations (Scopus)

Singularities at solder joint interfaces and their effects on fracture models: Part II

Bhate, D., Subbarayan, G., Nguyen, L. & Zhao, J., Sep 9 2008, 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM. p. 746-750 5 p. 4544342

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Crack propagation
Cracks
Fatigue of materials
Fracture mechanics
4 Citations (Scopus)

Singularities at solder joint interfaces and their effects on fracture models: Part I

Bhate, D., Subbarayan, G., Nguyen, L. & Zhao, J., Sep 9 2008, 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM. p. 738-745 8 p. 4544341

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Crack propagation
Cracks
Fatigue of materials
Fracture mechanics
2007
3 Citations (Scopus)

Adhesion of arbitrary-shaped thin-film microstructures

Bhate, D. & Dunn, M. L., Dec 1 2007, In : Microelectronics Reliability. 47, 12, p. 2014-2024 11 p.

Research output: Contribution to journalArticle

circular plates
adhesion
Adhesion
Thin films
microstructure
1 Citation (Scopus)

Constitutive behavior of SN3.8AG0.7CU and SN1.0AG0.5CU alloys at creep and low strain rate regimes

Bhate, D., Chan, D., Subbarayan, G., Chiu, T. C., Gupta, V. & Edwards, D., Jan 1 2007, Electronics and Photonics. American Society of Mechanical Engineers (ASME), Vol. 5. p. 183-196 14 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Strain rate
Creep
Constitutive models
Hardening
4 Citations (Scopus)

Effects of dwell time on the fatigue life of Sn3.8AgO.7Cu and Sn3.0Ag0.5Cu solder joints during simulated power cycling

Chan, D., Bhate, D., Subbarayan, G., Love, D. & Sullivan, R., Oct 22 2007, Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07. p. 227-234 8 p. 4249888

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Fatigue of materials
Ball grid arrays
Thermal fatigue
Weibull distribution
5 Citations (Scopus)

Fatigue crack growth and life descriptions of Sn3.8Ag0.7Cu solder joints: A computational and experimental study

Bhate, D., Chan, D., Subbarayan, G. & Nguyen, L., Oct 22 2007, Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07. p. 558-565 8 p. 4249937

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fatigue crack propagation
Soldering alloys
Creep
Thermal cycling
Hardening
2006

Adhesion of arbitrary-shaped thin-film microstructures

Bhate, D. & Dunn, M., Dec 1 2006, 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Vol. 2006. 1643993

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Adhesion
Thin films
Microstructure
Microsystems
Adhesives
3 Citations (Scopus)

A nonlinear fracture mechanics perspective on solder joint failure: Going beyond the Coffin-manson equation

Bhate, D. & Subbarayan, G., Dec 22 2006, Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006. Vol. 2006. p. 1220-1225 6 p. 1645484

Research output: Chapter in Book/Report/Conference proceedingConference contribution

fracture mechanics
solders
Fracture mechanics
Soldering alloys
fatigue life

Non-empirical modeling of fatigue in lead-free solder joints: Fatigue failure analysis and estimation of fracture parameters

Bhate, D., Chan, D. & Subbarayan, G., Dec 1 2006, 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Vol. 2006. 1643992

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Failure analysis
Soldering alloys
Fatigue of materials
Cracks
Fatigue testing
10 Citations (Scopus)

Solder interconnection specimen design and test control procedure for valid constitutive modeling of solder alloys

Bhate, D., Chan, D., Subbarayan, G. & Chiu, T. C., Dec 22 2006, Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006. Vol. 2006. p. 977-983 7 p. 1645451

Research output: Chapter in Book/Report/Conference proceedingConference contribution

solders
Soldering alloys
Constitutive models
Testing
Microstructure