Dhruv Bhate

Assoc Professor

  • 197 Citations
  • 7 h-Index
20062019

Research output per year

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Research Output

  • 197 Citations
  • 7 h-Index
  • 17 Conference contribution
  • 8 Article
  • 1 Comment/debate
  • 1 Review article
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Conference contribution
2018

Quasi-static and dynamic behavior of additively manufactured metallic lattice cylinders

Sadeghi, H., Bhate, D., Abraham, J. & Magallanes, J., Jul 3 2018, Shock Compression of Condensed Matter - 2017: Proceedings of the Conference of the American Physical Society Topical Group on Shock Compression of Condensed Matter. Knudson, M. D., Brown, E. N., Chau, R., Germann, T. C., Lane, J. M. D. & Eggert, J. H. (eds.). American Institute of Physics Inc., Vol. 1979. 070029

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2010

A multiscale damage accumulation theory for solder joint failure

Bhate, D., Mysore, K. & Subbarayan, G., Jun 30 2010, Proceedings of the ASME InterPack Conference 2009, IPACK2009. p. 191-197 7 p. (Proceedings of the ASME InterPack Conference 2009, IPACK2009; vol. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Characterization of crack fronts in a WLCSP package: Experiments and models for application of a multiscale fracture theory

Chan, D., Bhate, D., Subbarayan, G. & Nguyen, L., Jun 30 2010, Proceedings of the ASME InterPack Conference 2009, IPACK2009. p. 199-205 7 p. (Proceedings of the ASME InterPack Conference 2009, IPACK2009; vol. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

High strain rate behavior of Sn3.8Ag0.7Cu solder alloys and its influence on the fracture location within solder joints

Chan, D., Nie, X., Bhate, D., Subbarayan, G. & Dutta, I., Jun 25 2010, Proceedings of the ASME InterPack Conference 2009, IPACK2009. p. 989-995 7 p. (Proceedings of the ASME InterPack Conference 2009, IPACK2009; vol. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Scopus citations

Predicting crack growth and fatigue lives of QFN solder joints using a multiscale fracture model

Chan, D., Bhate, D., Subbarayan, G., Zhao, J. & Edwards, D., Jun 30 2010, Proceedings of the ASME InterPack Conference 2009, IPACK2009. p. 207-213 7 p. (Proceedings of the ASME InterPack Conference 2009, IPACK2009; vol. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2008

Aging-informed behavior of Sn3.8Ag0.7Cu solder alloys

Mysore, K., Chan, D., Bhate, D., Subbarayan, G., Dutta, I., Gupta, V., Zhao, J. & Edwards, D., Sep 9 2008, 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM. p. 870-875 6 p. 4544357. (2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Scopus citations

Constitutive behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu alloys at creep and low strain rate regimes

Bhate, D., Chan, D., Subbarayan, G., Chiu, T. C., Edwards, D. & Gupta, V., May 28 2008, Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007. p. 183-196 14 p. (ASME International Mechanical Engineering Congress and Exposition, Proceedings; vol. 5).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Rate-dependent behavior of Sn3.8Ag0.7Cu solder over strain rates of 10 -6 to 102 s-1

Nie, X., Bhate, D., Chan, D., Chen, W., Subbarayan, G. & Dutta, I., Jan 1 2008, 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM. IEEE Computer Society, p. 676-682 7 p. 4544333. (2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Scopus citations

Singularities at solder joint interfaces and their effects on fracture models: Part II

Bhate, D., Subbarayan, G., Nguyen, L. & Zhao, J., Sep 9 2008, 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM. p. 746-750 5 p. 4544342. (2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Singularities at solder joint interfaces and their effects on fracture models: Part I

Bhate, D., Subbarayan, G., Nguyen, L. & Zhao, J., Sep 9 2008, 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM. p. 738-745 8 p. 4544341. (2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations
2007

Constitutive behavior of SN3.8AG0.7CU and SN1.0AG0.5CU alloys at creep and low strain rate regimes

Bhate, D., Chan, D., Subbarayan, G., Chiu, T. C., Gupta, V. & Edwards, D., Jan 1 2007, Electronics and Photonics. American Society of Mechanical Engineers (ASME), Vol. 5. p. 183-196 14 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Effects of dwell time on the fatigue life of Sn3.8AgO.7Cu and Sn3.0Ag0.5Cu solder joints during simulated power cycling

Chan, D., Bhate, D., Subbarayan, G., Love, D. & Sullivan, R., Oct 22 2007, Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07. p. 227-234 8 p. 4249888. (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Fatigue crack growth and life descriptions of Sn3.8Ag0.7Cu solder joints: A computational and experimental study

Bhate, D., Chan, D., Subbarayan, G. & Nguyen, L., Oct 22 2007, Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07. p. 558-565 8 p. 4249937. (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Scopus citations
2006

Adhesion of arbitrary-shaped thin-film microstructures

Bhate, D. & Dunn, M., Dec 1 2006, 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. 1643993. (7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006; vol. 2006).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

A nonlinear fracture mechanics perspective on solder joint failure: Going beyond the Coffin-manson equation

Bhate, D. & Subbarayan, G., Dec 22 2006, Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006. p. 1220-1225 6 p. 1645484. (Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference; vol. 2006).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Non-empirical modeling of fatigue in lead-free solder joints: Fatigue failure analysis and estimation of fracture parameters

Bhate, D., Chan, D. & Subbarayan, G., Dec 1 2006, 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. 1643992. (7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006; vol. 2006).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Solder interconnection specimen design and test control procedure for valid constitutive modeling of solder alloys

Bhate, D., Chan, D., Subbarayan, G. & Chiu, T. C., Dec 22 2006, Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006. p. 977-983 7 p. 1645451. (Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference; vol. 2006).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Scopus citations