Fingerprint
Dive into the research topics of 'The effects of cooling rate on microstructure and mechanical behavior of Sn-3.5Ag solder'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
The effects of cooling rate on microstructure and mechanical behavior of Sn-3.5Ag solder
F. Ochoa, J. J. Williams, Nikhilesh Chawla
Research output: Contribution to journal › Article › peer-review
83
Scopus
citations