TY - JOUR
T1 - The effects of cooling rate on microstructure and mechanical behavior of Sn-3.5Ag solder
AU - Ochoa, F.
AU - Williams, J. J.
AU - Chawla, Nikhilesh
N1 - Funding Information:
The authors acknowledge financial support for this research from the National Science Foundation under contract #DMR-0092530 (K.L. Murty, program manager). We would also like to thank Indium Corporation for supplying the solder ingots.
PY - 2003/6
Y1 - 2003/6
N2 - The microstructure, tensile, and creep behavior of bulk Sn-3.5Ag solder were studied as a function of cooling rate. Controlled cooling rates were obtained by cooling specimens in different media: water, air, or furnace. The cooling rate significantly affected secondary dendrite arm size and spacing of the tin-rich phase, as well as the morphology of Ag3Sn. Ag3Sn was relatively spherical at the fastest cooling rate and had a needle-like morphology at the slowest cooling rate. Both the yield strength in tension and creep resistance of Sn-3.5Ag solder increased with increasing cooling rate while the strain-to-failure decreased. In this study, the mechanical behavior was correlated with the observed microstructure, creep-stress exponents, and fracture behavior, in order to understand the underlying damage mechanisms.
AB - The microstructure, tensile, and creep behavior of bulk Sn-3.5Ag solder were studied as a function of cooling rate. Controlled cooling rates were obtained by cooling specimens in different media: water, air, or furnace. The cooling rate significantly affected secondary dendrite arm size and spacing of the tin-rich phase, as well as the morphology of Ag3Sn. Ag3Sn was relatively spherical at the fastest cooling rate and had a needle-like morphology at the slowest cooling rate. Both the yield strength in tension and creep resistance of Sn-3.5Ag solder increased with increasing cooling rate while the strain-to-failure decreased. In this study, the mechanical behavior was correlated with the observed microstructure, creep-stress exponents, and fracture behavior, in order to understand the underlying damage mechanisms.
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U2 - 10.1007/s11837-003-0142-7
DO - 10.1007/s11837-003-0142-7
M3 - Article
AN - SCOPUS:0038036027
SN - 1047-4838
VL - 55
SP - 56
EP - 60
JO - JOM
JF - JOM
IS - 6
ER -