The effects of cooling rate on microstructure and mechanical behavior of Sn-3.5Ag solder

F. Ochoa; J. J. Williams; Nikhilesh Chawla

doi:10.1007/s11837-003-0142-7

The effects of cooling rate on microstructure and mechanical behavior of Sn-3.5Ag solder

F. Ochoa, J. J. Williams, Nikhilesh Chawla

Chemical Engineering

Research output: Contribution to journal › Article › peer-review

66 Scopus citations

Abstract

The microstructure, tensile, and creep behavior of bulk Sn-3.5Ag solder were studied as a function of cooling rate. Controlled cooling rates were obtained by cooling specimens in different media: water, air, or furnace. The cooling rate significantly affected secondary dendrite arm size and spacing of the tin-rich phase, as well as the morphology of Ag₃Sn. Ag₃Sn was relatively spherical at the fastest cooling rate and had a needle-like morphology at the slowest cooling rate. Both the yield strength in tension and creep resistance of Sn-3.5Ag solder increased with increasing cooling rate while the strain-to-failure decreased. In this study, the mechanical behavior was correlated with the observed microstructure, creep-stress exponents, and fracture behavior, in order to understand the underlying damage mechanisms.

Original language	English (US)
Pages (from-to)	56-60
Number of pages	5
Journal	JOM
Volume	55
Issue number	6
DOIs	https://doi.org/10.1007/s11837-003-0142-7
State	Published - Jun 2003

ASJC Scopus subject areas

Materials Science(all)
Engineering(all)

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10.1007/s11837-003-0142-7

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title = "The effects of cooling rate on microstructure and mechanical behavior of Sn-3.5Ag solder",

abstract = "The microstructure, tensile, and creep behavior of bulk Sn-3.5Ag solder were studied as a function of cooling rate. Controlled cooling rates were obtained by cooling specimens in different media: water, air, or furnace. The cooling rate significantly affected secondary dendrite arm size and spacing of the tin-rich phase, as well as the morphology of Ag3Sn. Ag3Sn was relatively spherical at the fastest cooling rate and had a needle-like morphology at the slowest cooling rate. Both the yield strength in tension and creep resistance of Sn-3.5Ag solder increased with increasing cooling rate while the strain-to-failure decreased. In this study, the mechanical behavior was correlated with the observed microstructure, creep-stress exponents, and fracture behavior, in order to understand the underlying damage mechanisms.",

author = "F. Ochoa and Williams, {J. J.} and Nikhilesh Chawla",

note = "Funding Information: The authors acknowledge financial support for this research from the National Science Foundation under contract #DMR-0092530 (K.L. Murty, program manager). We would also like to thank Indium Corporation for supplying the solder ingots.",

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AU - Ochoa, F.

AU - Williams, J. J.

AU - Chawla, Nikhilesh

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Y1 - 2003/6

N2 - The microstructure, tensile, and creep behavior of bulk Sn-3.5Ag solder were studied as a function of cooling rate. Controlled cooling rates were obtained by cooling specimens in different media: water, air, or furnace. The cooling rate significantly affected secondary dendrite arm size and spacing of the tin-rich phase, as well as the morphology of Ag3Sn. Ag3Sn was relatively spherical at the fastest cooling rate and had a needle-like morphology at the slowest cooling rate. Both the yield strength in tension and creep resistance of Sn-3.5Ag solder increased with increasing cooling rate while the strain-to-failure decreased. In this study, the mechanical behavior was correlated with the observed microstructure, creep-stress exponents, and fracture behavior, in order to understand the underlying damage mechanisms.

AB - The microstructure, tensile, and creep behavior of bulk Sn-3.5Ag solder were studied as a function of cooling rate. Controlled cooling rates were obtained by cooling specimens in different media: water, air, or furnace. The cooling rate significantly affected secondary dendrite arm size and spacing of the tin-rich phase, as well as the morphology of Ag3Sn. Ag3Sn was relatively spherical at the fastest cooling rate and had a needle-like morphology at the slowest cooling rate. Both the yield strength in tension and creep resistance of Sn-3.5Ag solder increased with increasing cooling rate while the strain-to-failure decreased. In this study, the mechanical behavior was correlated with the observed microstructure, creep-stress exponents, and fracture behavior, in order to understand the underlying damage mechanisms.

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The effects of cooling rate on microstructure and mechanical behavior of Sn-3.5Ag solder

Abstract

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