The effects of cooling rate on microstructure and mechanical behavior of Sn-3.5Ag solder

F. Ochoa, J. J. Williams, Nikhilesh Chawla

Research output: Contribution to journalArticle

76 Scopus citations

Abstract

The microstructure, tensile, and creep behavior of bulk Sn-3.5Ag solder were studied as a function of cooling rate. Controlled cooling rates were obtained by cooling specimens in different media: water, air, or furnace. The cooling rate significantly affected secondary dendrite arm size and spacing of the tin-rich phase, as well as the morphology of Ag3Sn. Ag3Sn was relatively spherical at the fastest cooling rate and had a needle-like morphology at the slowest cooling rate. Both the yield strength in tension and creep resistance of Sn-3.5Ag solder increased with increasing cooling rate while the strain-to-failure decreased. In this study, the mechanical behavior was correlated with the observed microstructure, creep-stress exponents, and fracture behavior, in order to understand the underlying damage mechanisms.

Original languageEnglish (US)
Pages (from-to)56-60
Number of pages5
JournalJOM
Volume55
Issue number6
DOIs
StatePublished - Jun 2003

ASJC Scopus subject areas

  • Materials Science(all)
  • Engineering(all)

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