Nanoscale Three-Dimensional Microstructural Characterization of an Sn-Rich Solder Alloy Using High-Resolution Transmission X-Ray Microscopy (TXM)

Chandrashekara S. Kaira, Carl R. Mayer, V. De Andrade, Francesco De Carlo, Nikhilesh Chawla

Research output: Contribution to journalArticle

5 Scopus citations

Abstract

Three-dimensional (3D) nondestructive microstructural characterization was performed using full-field transmission X-ray microscopy on an Sn-rich alloy, at a spatial resolution of 60 nm. This study highlights the use of synchrotron radiation along with Fresnel zone plate optics to perform absorption contrast tomography for analyzing nanoscale features of fine second phase particles distributed in the tin matrix, which are representative of the bulk microstructure. The 3D reconstruction was also used to quantify microstructural details of the analyzed volume.

Original languageEnglish (US)
Pages (from-to)1-6
Number of pages6
JournalMicroscopy and Microanalysis
DOIs
StateAccepted/In press - Jul 18 2016

Keywords

  • intermetallics
  • lead-free solder
  • transmission X-ray microscopy
  • X-ray synchrotron

ASJC Scopus subject areas

  • Instrumentation

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