Nanoscale three-dimensional microstructural characterization of an Sn-rich solder alloy using high-resolution transmission X-ray microscopy (TXM)

Chandrashekara S. Kaira, Carl R. Mayer, V. De Andrade, Francesco De Carlo, Nikhilesh Chawla

Research output: Contribution to journal › Article › peer-review

8 Scopus citations

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Engineering & Materials Science

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