Effects of dwell time on the fatigue life of Sn3.8AgO.7Cu and Sn3.0Ag0.5Cu solder joints during simulated power cycling

D. Chan, D. Bhate, G. Subbarayan, D. Love, R. Sullivan

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

6 Scopus citations

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Chemical Compounds

Engineering & Materials Science