TY - GEN
T1 - Effects of dwell time on the fatigue life of Sn3.8AgO.7Cu and Sn3.0Ag0.5Cu solder joints during simulated power cycling
AU - Chan, D.
AU - Bhate, D.
AU - Subbarayan, G.
AU - Love, D.
AU - Sullivan, R.
PY - 2007
Y1 - 2007
N2 - Compared to Sn-Pb solder joints, our understanding of the fatigue of SnAgCu solder joints is far from complete. The challenges to achieving a complete understanding of SnAgCu solder joint fatigue arise partly from their significantly different creep behavior and vulnerability to microstructure evolution (aging). In this paper, we present results from thermal fatigue tests carried out with the help of a simulated power cycling tester. The test specimens were 1.27mm pitch Ceramic Ball-Grid Array (CBGA) components with two lead-free solder alloy compositions - Sn3.8Ag0.7Cu and Sn3.0Ag0.5Cu. The components were subjected to hot dwells at 100°C for 10, 30 and 60 minutes to study the effect of dwell time on the fatigue life - a total of 48 components were tested. The resulting failure data was fit to a Weibull distribution. The packages were stored at room temperature prior to testing and the effect of the time of storage on the fatigue life was also studied. Finite element analyses were performed to study the effect of hot dwell time on the fatigue life of the CBGA component.
AB - Compared to Sn-Pb solder joints, our understanding of the fatigue of SnAgCu solder joints is far from complete. The challenges to achieving a complete understanding of SnAgCu solder joint fatigue arise partly from their significantly different creep behavior and vulnerability to microstructure evolution (aging). In this paper, we present results from thermal fatigue tests carried out with the help of a simulated power cycling tester. The test specimens were 1.27mm pitch Ceramic Ball-Grid Array (CBGA) components with two lead-free solder alloy compositions - Sn3.8Ag0.7Cu and Sn3.0Ag0.5Cu. The components were subjected to hot dwells at 100°C for 10, 30 and 60 minutes to study the effect of dwell time on the fatigue life - a total of 48 components were tested. The resulting failure data was fit to a Weibull distribution. The packages were stored at room temperature prior to testing and the effect of the time of storage on the fatigue life was also studied. Finite element analyses were performed to study the effect of hot dwell time on the fatigue life of the CBGA component.
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U2 - 10.1109/ECTC.2007.373802
DO - 10.1109/ECTC.2007.373802
M3 - Conference contribution
AN - SCOPUS:35348924851
SN - 1424409853
SN - 9781424409853
T3 - Proceedings - Electronic Components and Technology Conference
SP - 227
EP - 234
BT - Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
T2 - 57th Electronic Components and Technology Conference 2007, ECTC '07
Y2 - 29 May 2007 through 1 June 2007
ER -