Effects of dwell time on the fatigue life of Sn3.8AgO.7Cu and Sn3.0Ag0.5Cu solder joints during simulated power cycling

D. Chan, Dhruv Bhate, G. Subbarayan, D. Love, R. Sullivan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Compared to Sn-Pb solder joints, our understanding of the fatigue of SnAgCu solder joints is far from complete. The challenges to achieving a complete understanding of SnAgCu solder joint fatigue arise partly from their significantly different creep behavior and vulnerability to microstructure evolution (aging). In this paper, we present results from thermal fatigue tests carried out with the help of a simulated power cycling tester. The test specimens were 1.27mm pitch Ceramic Ball-Grid Array (CBGA) components with two lead-free solder alloy compositions - Sn3.8Ag0.7Cu and Sn3.0Ag0.5Cu. The components were subjected to hot dwells at 100°C for 10, 30 and 60 minutes to study the effect of dwell time on the fatigue life - a total of 48 components were tested. The resulting failure data was fit to a Weibull distribution. The packages were stored at room temperature prior to testing and the effect of the time of storage on the fatigue life was also studied. Finite element analyses were performed to study the effect of hot dwell time on the fatigue life of the CBGA component.

Original languageEnglish (US)
Title of host publicationProceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
Pages227-234
Number of pages8
DOIs
StatePublished - Oct 22 2007
Externally publishedYes
Event57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV, United States
Duration: May 29 2007Jun 1 2007

Other

Other57th Electronic Components and Technology Conference 2007, ECTC '07
CountryUnited States
CitySparks, NV
Period5/29/076/1/07

Fingerprint

Soldering alloys
Fatigue of materials
Ball grid arrays
Thermal fatigue
Weibull distribution
Creep
Aging of materials
Microstructure
Testing
Chemical analysis
Temperature

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Chan, D., Bhate, D., Subbarayan, G., Love, D., & Sullivan, R. (2007). Effects of dwell time on the fatigue life of Sn3.8AgO.7Cu and Sn3.0Ag0.5Cu solder joints during simulated power cycling. In Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07 (pp. 227-234). [4249888] https://doi.org/10.1109/ECTC.2007.373802

Effects of dwell time on the fatigue life of Sn3.8AgO.7Cu and Sn3.0Ag0.5Cu solder joints during simulated power cycling. / Chan, D.; Bhate, Dhruv; Subbarayan, G.; Love, D.; Sullivan, R.

Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07. 2007. p. 227-234 4249888.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Chan, D, Bhate, D, Subbarayan, G, Love, D & Sullivan, R 2007, Effects of dwell time on the fatigue life of Sn3.8AgO.7Cu and Sn3.0Ag0.5Cu solder joints during simulated power cycling. in Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07., 4249888, pp. 227-234, 57th Electronic Components and Technology Conference 2007, ECTC '07, Sparks, NV, United States, 5/29/07. https://doi.org/10.1109/ECTC.2007.373802
Chan D, Bhate D, Subbarayan G, Love D, Sullivan R. Effects of dwell time on the fatigue life of Sn3.8AgO.7Cu and Sn3.0Ag0.5Cu solder joints during simulated power cycling. In Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07. 2007. p. 227-234. 4249888 https://doi.org/10.1109/ECTC.2007.373802
Chan, D. ; Bhate, Dhruv ; Subbarayan, G. ; Love, D. ; Sullivan, R. / Effects of dwell time on the fatigue life of Sn3.8AgO.7Cu and Sn3.0Ag0.5Cu solder joints during simulated power cycling. Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07. 2007. pp. 227-234
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