Effect of alloying and cladding on the failure of silver metallization under high temperature and current stressing

E. Misra; Terry Alford

doi:10.1063/1.2117633

Effect of alloying and cladding on the failure of silver metallization under high temperature and current stressing

E. Misra, Terry Alford

Research output: Contribution to journal › Article › peer-review

8 Scopus citations

Abstract

Pure Ag layers were cladded with thin alloy (Ag with 3 at. % aluminum) layers to form a [Ag (Al) AgAg (Al)] structure on SiO2. The effective resistivity of the cladded Ag metallization is slightly greater than pure silver and less than the Ag(Al) alloy metallization. The clad structures showed a nearly 38 times enhancement in electromigration resistance when compared to pure Ag and seven times greater than the Ag(Al) alloy. The enhancement in lifetime of the clad structure was attributed to enhanced thermal stability due to segregation of Al2 O3 at the Ag grain boundaries leading to reduced grain size and changes in thermodynamic properties and also reduced atomic mobility because of the topmost layer acting as a passivation layer.

Original language	English (US)
Article number	172111
Pages (from-to)	1-3
Number of pages	3
Journal	Applied Physics Letters
Volume	87
Issue number	17
DOIs	https://doi.org/10.1063/1.2117633
State	Published - Oct 24 2005

ASJC Scopus subject areas

Physics and Astronomy (miscellaneous)

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10.1063/1.2117633

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title = "Effect of alloying and cladding on the failure of silver metallization under high temperature and current stressing",

abstract = "Pure Ag layers were cladded with thin alloy (Ag with 3 at. % aluminum) layers to form a [Ag (Al) AgAg (Al)] structure on SiO2. The effective resistivity of the cladded Ag metallization is slightly greater than pure silver and less than the Ag(Al) alloy metallization. The clad structures showed a nearly 38 times enhancement in electromigration resistance when compared to pure Ag and seven times greater than the Ag(Al) alloy. The enhancement in lifetime of the clad structure was attributed to enhanced thermal stability due to segregation of Al2 O3 at the Ag grain boundaries leading to reduced grain size and changes in thermodynamic properties and also reduced atomic mobility because of the topmost layer acting as a passivation layer.",

author = "E. Misra and Terry Alford",

note = "Funding Information: The authors are grateful to the National Science Foundation (Grant No. DMR-0308127) for partial support. This work was carried out at the National Science Foundations{\textquoteright} State/Industry/University Cooperative Research Centers (NSF-S/I/UCRC) Center for Low Power Electronics (CLPE). The authors are also grateful to Dr. J. W. Mayer from Arizona State University, and Dr. Hyunchul Kim (XPS analysis) from Intel Corp. for their support in this project. One of the authors (E.M.) is grateful to D. K. Misra for his support and encouragement in this project.",

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AU - Misra, E.

AU - Alford, Terry

N1 - Funding Information: The authors are grateful to the National Science Foundation (Grant No. DMR-0308127) for partial support. This work was carried out at the National Science Foundations’ State/Industry/University Cooperative Research Centers (NSF-S/I/UCRC) Center for Low Power Electronics (CLPE). The authors are also grateful to Dr. J. W. Mayer from Arizona State University, and Dr. Hyunchul Kim (XPS analysis) from Intel Corp. for their support in this project. One of the authors (E.M.) is grateful to D. K. Misra for his support and encouragement in this project.

PY - 2005/10/24

Y1 - 2005/10/24

N2 - Pure Ag layers were cladded with thin alloy (Ag with 3 at. % aluminum) layers to form a [Ag (Al) AgAg (Al)] structure on SiO2. The effective resistivity of the cladded Ag metallization is slightly greater than pure silver and less than the Ag(Al) alloy metallization. The clad structures showed a nearly 38 times enhancement in electromigration resistance when compared to pure Ag and seven times greater than the Ag(Al) alloy. The enhancement in lifetime of the clad structure was attributed to enhanced thermal stability due to segregation of Al2 O3 at the Ag grain boundaries leading to reduced grain size and changes in thermodynamic properties and also reduced atomic mobility because of the topmost layer acting as a passivation layer.

AB - Pure Ag layers were cladded with thin alloy (Ag with 3 at. % aluminum) layers to form a [Ag (Al) AgAg (Al)] structure on SiO2. The effective resistivity of the cladded Ag metallization is slightly greater than pure silver and less than the Ag(Al) alloy metallization. The clad structures showed a nearly 38 times enhancement in electromigration resistance when compared to pure Ag and seven times greater than the Ag(Al) alloy. The enhancement in lifetime of the clad structure was attributed to enhanced thermal stability due to segregation of Al2 O3 at the Ag grain boundaries leading to reduced grain size and changes in thermodynamic properties and also reduced atomic mobility because of the topmost layer acting as a passivation layer.

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Effect of alloying and cladding on the failure of silver metallization under high temperature and current stressing

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