Effect of alloying and cladding on the failure of silver metallization under high temperature and current stressing

E. Misra, Terry Alford

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Abstract

Pure Ag layers were cladded with thin alloy (Ag with 3 at. % aluminum) layers to form a [Ag (Al) AgAg (Al)] structure on SiO2. The effective resistivity of the cladded Ag metallization is slightly greater than pure silver and less than the Ag(Al) alloy metallization. The clad structures showed a nearly 38 times enhancement in electromigration resistance when compared to pure Ag and seven times greater than the Ag(Al) alloy. The enhancement in lifetime of the clad structure was attributed to enhanced thermal stability due to segregation of Al2 O3 at the Ag grain boundaries leading to reduced grain size and changes in thermodynamic properties and also reduced atomic mobility because of the topmost layer acting as a passivation layer.

Original languageEnglish (US)
Article number172111
Pages (from-to)1-3
Number of pages3
JournalApplied Physics Letters
Volume87
Issue number17
DOIs
StatePublished - Oct 24 2005

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ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

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