Working distance comparison of inductive and electromagnetic couplings for wireless and passive underwater monitoring system of rinsing process in semiconductor facilities

Xu Zhang, Junseok Chae

Research output: Contribution to journalArticle

13 Citations (Scopus)

Abstract

This paper reports a side-by-side comparison of two wireless and passive sensing systems: inductive and electromagnetic (EM) couplings for an application of in-situ and real-time monitoring of wafer cleanliness in the rinsing process at semiconductor/microelectromechanical system (MEMS) manufacturing facilities. A MEMS sensor is designed to measure the resistivity of water, corresponding to the ionic concentration, to evaluate the rinsing process inside the micro-features. The transponder, containing the MEMS sensor, receives power from an external interrogator, modulates the resistivity data, and emits back the modulated signal to the interrogator, in all wireless and battery-free operation. Two wireless systems based on inductive and EM couplings have been implemented on 4-inch glass wafers, maintaining the wafer form factor. Inductive coupling system has parasitic electric field coupling. The working distance of the inductive coupling system is attenuated in water and is likely limited by signal-to-noise ratio (SNR), while that of the EM coupling is primarily limited by the coupled power. Hence, inductive coupling is suitable for a short distance measurement that allows more sophisticated functionality with sufficient power, whereas EM coupling could be optimized for long distance detection but has a tight power budget. The implemented on-wafer wireless monitoring units achieve a working distance of 6 and 25 cm with a concentration resolution of less than 2% (4 ppb for a 200 ppb solution) for inductive and EM couplings, respectively.

Original languageEnglish (US)
Article number5763744
Pages (from-to)2932-2939
Number of pages8
JournalIEEE Sensors Journal
Volume11
Issue number11
DOIs
StatePublished - 2011

Fingerprint

Electromagnetic coupling
electromagnetic coupling
Semiconductor materials
Monitoring
wafers
microelectromechanical systems
MEMS
cleanliness
transponders
electrical resistivity
Distance measurement
Transponders
sensors
Sensors
budgets
water
electric batteries
form factors
Water
Signal to noise ratio

Keywords

  • Electromagnetic (EM) coupling
  • inductive coupling
  • passive sensing
  • underwater sensing
  • wireless sensing

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Instrumentation

Cite this

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abstract = "This paper reports a side-by-side comparison of two wireless and passive sensing systems: inductive and electromagnetic (EM) couplings for an application of in-situ and real-time monitoring of wafer cleanliness in the rinsing process at semiconductor/microelectromechanical system (MEMS) manufacturing facilities. A MEMS sensor is designed to measure the resistivity of water, corresponding to the ionic concentration, to evaluate the rinsing process inside the micro-features. The transponder, containing the MEMS sensor, receives power from an external interrogator, modulates the resistivity data, and emits back the modulated signal to the interrogator, in all wireless and battery-free operation. Two wireless systems based on inductive and EM couplings have been implemented on 4-inch glass wafers, maintaining the wafer form factor. Inductive coupling system has parasitic electric field coupling. The working distance of the inductive coupling system is attenuated in water and is likely limited by signal-to-noise ratio (SNR), while that of the EM coupling is primarily limited by the coupled power. Hence, inductive coupling is suitable for a short distance measurement that allows more sophisticated functionality with sufficient power, whereas EM coupling could be optimized for long distance detection but has a tight power budget. The implemented on-wafer wireless monitoring units achieve a working distance of 6 and 25 cm with a concentration resolution of less than 2{\%} (4 ppb for a 200 ppb solution) for inductive and EM couplings, respectively.",
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