Ultrasonic Methods for Inline Solar Cell Interconnector Inspection: Method Overview, Applications and Limits

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Digitalization' of our industry in terms of materials, components and manufacturing as well as logistics and markets is one of the most promising concepts for achieving longterm overall cost reductions, high reliability and quality assurance within the 'industry 4.0'. To achieve this long-term goal, several challenges must be overcome: Among others, reliable and inlinecapable characterization methods are the key technology to deliver input and verification for the digital representative ('digital twin'). This paper gives an overview of three ultrasonic methods developed for inline characterization of copper ribbons used to interconnect solar cells in a solar module. Material parameters of these ribbons are crucial for the soldering process and the future reliability of solar modules. The three methods are based on different physical effects: 1) Determination of elastic constants by ultrasonic dispersion analysis; 2) Acoustoelastic microstructural analysis; 3) Determination of mean grain size by ultrasonic scattering analysis. Each method has its own specific range of application: Method 1 proved to be very stable and reliable for elastic constant evaluation (Young's modulus, Poison's ratio) in all areas of ribbon production and module manufacturing. Method 2 is most sensitive and suitable for detecting small changes in microstructure due to mechanical loading or manufacturing process variation. It is therefore well-suited to inline quality check in module production. Method 3 allows determination of the mean grain size, characterizing the annealing process. Mechanical loading must be avoided here, as generated dislocations also influence the attenuation. The newly developed methods and achieved results indicate enormous potential for ribbon characterization on an industrial scale and fit well in the 'industry 4.0' concept.

Original languageEnglish (US)
Title of host publication2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages2229-2233
Number of pages5
ISBN (Electronic)9781538685297
DOIs
StatePublished - Nov 26 2018
Event7th IEEE World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - Waikoloa Village, United States
Duration: Jun 10 2018Jun 15 2018

Publication series

Name2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC

Other

Other7th IEEE World Conference on Photovoltaic Energy Conversion, WCPEC 2018
CountryUnited States
CityWaikoloa Village
Period6/10/186/15/18

Keywords

  • interconnectors
  • module production
  • process control
  • reliability
  • ribbon
  • soldering
  • stress
  • ultrasound

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Renewable Energy, Sustainability and the Environment
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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  • Cite this

    MEIER, R. (2018). Ultrasonic Methods for Inline Solar Cell Interconnector Inspection: Method Overview, Applications and Limits. In 2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC (pp. 2229-2233). [8547839] (2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/PVSC.2018.8547839