Abstract

Strain distribution exists in all microelectronic devices, including emerging flexible[1] and foldable[2] electronics. When a device is subject to bending or elevated temperature, the mechanical and electrical properties change. In some cases induced or applied strain can cause the device to fail[3-5]. For this reason, accurate strain mapping techniques are of great interest[6] to the electronics industry and could provide a detailed understanding of the strain distribution across a device. This understanding will help improve the structure or layout design of mechanical and electronic devices. The laser scanning technique demonstrated in this work could potentially provide a solution to map the two dimensional (2D) strain distribution within an electronic package. We have validated the strain sensitivity and spatial resolution of features for the device in a previous report[7, 8] and are now applying the technique to a practical microelectronic package sample. Here, we demonstrate 2D strain mapping capability by preforming 2D scans across the composite solder bump region at room temperature and an elevated temperature.

Original languageEnglish (US)
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages396-401
Number of pages6
Volume2015-July
ISBN (Print)9781479986095
DOIs
StatePublished - Jul 15 2015
Event2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015 - San Diego, United States
Duration: May 26 2015May 29 2015

Other

Other2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015
CountryUnited States
CitySan Diego
Period5/26/155/29/15

Fingerprint

Microelectronics
Scanning
Lasers
Preforming
Electronics industry
Soldering alloys
Temperature
Electric properties
Electronic equipment
Mechanical properties
Composite materials

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Liang, H., Houghton, T., Song, Z., Ma, T., Nguyen, H., Chen, G., ... Yu, H. (2015). Two-dimensional (2D) in-plane strain mapping using a laser scanning technique on the cross-section of a microelectronics package. In Proceedings - Electronic Components and Technology Conference (Vol. 2015-July, pp. 396-401). [7159623] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2015.7159623

Two-dimensional (2D) in-plane strain mapping using a laser scanning technique on the cross-section of a microelectronics package. / Liang, Hanshuang; Houghton, Todd; Song, Zeming; Ma, Teng; Nguyen, Hoa; Chen, George; Jiang, Hanqing; Yu, Hongbin.

Proceedings - Electronic Components and Technology Conference. Vol. 2015-July Institute of Electrical and Electronics Engineers Inc., 2015. p. 396-401 7159623.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Liang, H, Houghton, T, Song, Z, Ma, T, Nguyen, H, Chen, G, Jiang, H & Yu, H 2015, Two-dimensional (2D) in-plane strain mapping using a laser scanning technique on the cross-section of a microelectronics package. in Proceedings - Electronic Components and Technology Conference. vol. 2015-July, 7159623, Institute of Electrical and Electronics Engineers Inc., pp. 396-401, 2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015, San Diego, United States, 5/26/15. https://doi.org/10.1109/ECTC.2015.7159623
Liang H, Houghton T, Song Z, Ma T, Nguyen H, Chen G et al. Two-dimensional (2D) in-plane strain mapping using a laser scanning technique on the cross-section of a microelectronics package. In Proceedings - Electronic Components and Technology Conference. Vol. 2015-July. Institute of Electrical and Electronics Engineers Inc. 2015. p. 396-401. 7159623 https://doi.org/10.1109/ECTC.2015.7159623
Liang, Hanshuang ; Houghton, Todd ; Song, Zeming ; Ma, Teng ; Nguyen, Hoa ; Chen, George ; Jiang, Hanqing ; Yu, Hongbin. / Two-dimensional (2D) in-plane strain mapping using a laser scanning technique on the cross-section of a microelectronics package. Proceedings - Electronic Components and Technology Conference. Vol. 2015-July Institute of Electrical and Electronics Engineers Inc., 2015. pp. 396-401
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