1 Scopus citations


Strain distribution exists in all microelectronic devices, including emerging flexible[1] and foldable[2] electronics. When a device is subject to bending or elevated temperature, the mechanical and electrical properties change. In some cases induced or applied strain can cause the device to fail[3-5]. For this reason, accurate strain mapping techniques are of great interest[6] to the electronics industry and could provide a detailed understanding of the strain distribution across a device. This understanding will help improve the structure or layout design of mechanical and electronic devices. The laser scanning technique demonstrated in this work could potentially provide a solution to map the two dimensional (2D) strain distribution within an electronic package. We have validated the strain sensitivity and spatial resolution of features for the device in a previous report[7, 8] and are now applying the technique to a practical microelectronic package sample. Here, we demonstrate 2D strain mapping capability by preforming 2D scans across the composite solder bump region at room temperature and an elevated temperature.

Original languageEnglish (US)
Title of host publication2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages6
ISBN (Electronic)9781479986095
StatePublished - Jul 15 2015
Event2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015 - San Diego, United States
Duration: May 26 2015May 29 2015

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503


Other2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015
Country/TerritoryUnited States
CitySan Diego

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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