Abstract
The thermal stability of Ag deposited on parylene-n (Pa-n) was studied for its application in ultralarge scale integrated (ULSI) circuits. No interaction of phase formation between Ag and Pa-n and the structure was found to be electrically stable even at high temperatures. Surface treatment of Pa-n with oxygen plasma improved the adhesion between Ag and Pa-n without sacrificing the thermal and electrical stability of the system.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 2814-2819 |
| Number of pages | 6 |
| Journal | Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures |
| Volume | 18 |
| Issue number | 6 |
| DOIs | |
| State | Published - Nov 2000 |
| Event | 44th International Conference on Electron, Ion, and Photon Beam Technology and Nanofabrication - Rancho Mirage, CA, USA Duration: May 30 2000 → Jun 2 2000 |
ASJC Scopus subject areas
- Condensed Matter Physics
- Electrical and Electronic Engineering