Thermal stability and adhesion improvement of Ag deposited on Pa-n by oxygen plasma treatment

Kaustubh S. Gadre, Terry Alford

Research output: Contribution to journalArticle

18 Citations (Scopus)

Abstract

The thermal stability of Ag deposited on parylene-n (Pa-n) was studied for its application in ultralarge scale integrated (ULSI) circuits. No interaction of phase formation between Ag and Pa-n and the structure was found to be electrically stable even at high temperatures. Surface treatment of Pa-n with oxygen plasma improved the adhesion between Ag and Pa-n without sacrificing the thermal and electrical stability of the system.

Original languageEnglish (US)
Pages (from-to)2814-2819
Number of pages6
JournalJournal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume18
Issue number6
DOIs
StatePublished - Nov 2000

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Integrated circuits
Surface treatment
Thermodynamic stability
Adhesion
Plasmas
Oxygen
Temperature
Hot Temperature

ASJC Scopus subject areas

  • Engineering(all)

Cite this

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abstract = "The thermal stability of Ag deposited on parylene-n (Pa-n) was studied for its application in ultralarge scale integrated (ULSI) circuits. No interaction of phase formation between Ag and Pa-n and the structure was found to be electrically stable even at high temperatures. Surface treatment of Pa-n with oxygen plasma improved the adhesion between Ag and Pa-n without sacrificing the thermal and electrical stability of the system.",
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