Thermal cycling induced load on copper-ribbons in crystalline photovoltaic modules

R. Meier, F. Kraemer, S. Wiese, K. J. Wolter, J. Bagdahn

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

Solar module lifetime is limited by the fatigue behavior of its cell interconnectors: the copper-ribbons. Every change in temperature induces thermo-mechanical stresses in the module components due to their thermo-mechanical mismatch. The purpose of this work is to quantify this load on the copper-ribbons between the individual cells of a cell string during a thermal cycling test by measuring cell displacement using digital image correlation and to compare the results to finite element analysis (FEM). Furthermore with help of FEM the influences of different materials were investigated, allowing material and layout optimizations with respect to copper-ribbon loading.

Original languageEnglish (US)
Title of host publicationReliability of Photovoltaic Cells, Modules, Components, and Systems III
DOIs
StatePublished - Oct 18 2010
Externally publishedYes
EventReliability of Photovoltaic Cells, Modules, Components, and Systems III - San Diego, CA, United States
Duration: Aug 3 2010Aug 5 2010

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume7773
ISSN (Print)0277-786X

Other

OtherReliability of Photovoltaic Cells, Modules, Components, and Systems III
CountryUnited States
CitySan Diego, CA
Period8/3/108/5/10

Keywords

  • FEM
  • Reliability
  • Ribbon
  • Thermal cycling test
  • Thermo-mechanical

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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