Abstract
A customizable and predictive BSIM model was generated for devices with Leff down to 12 nm and a wide range of interconnect sizes. The main advantages of this approach over previous work were its applicability to generic technologies as well as the ease of use provided by a Web-based distribution model. These predictive technology models will be useful for circuit design research aimed at processes that were not yet available.
Original language | English (US) |
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Pages (from-to) | 17-23 |
Number of pages | 7 |
Journal | IEEE Circuits and Devices Magazine |
Volume | 19 |
Issue number | 4 |
DOIs | |
State | Published - Jul 2003 |
Externally published | Yes |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Instrumentation
- Electrical and Electronic Engineering