Solder interconnection specimen design and test control procedure for valid constitutive modeling of solder alloys

D. Bhate, D. Chan, G. Subbarayan, T. C. Chiu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Scopus citations

Fingerprint

Dive into the research topics of 'Solder interconnection specimen design and test control procedure for valid constitutive modeling of solder alloys'. Together they form a unique fingerprint.

Chemical Compounds

Engineering & Materials Science

Physics & Astronomy