Self-heating effects in high performance devices

We investigate self-heating effects in single-gate and dual-gate device structures and structures that have AlN (aluminum nitride) and diamond as a buried oxide layer. We also investigate both electrical and thermal enhancement and degradation respectively, due to self-heating effects in fully-depleted SOI devices that have arbitrary transport and crystallographic direction. Our simulation analysis suggests that in all these alternative device technologies self-heating is dramatically reduced in short channel devices due to the pronounced velocity overshoot effect. Moreover, the use of AlN and diamond as a buried oxide layer further reduces the current degradation due to self heating to insignificant values because of the drastic reduction of the thermal resistance of the buried oxide layer.