Reversible Stress Relaxation during Precoalescence Interruptions of Volmer-Weber Thin Film Growth

C. Friesen, C. V. Thompson

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Abstract

From in situ stress measurements, we have observed that a large component of the precoalescence compressive stress that develops during Volmer-Weber growth of polycrystalline Cu films relaxes reversibly. This phenomenon is similar to the reversible stress relaxation previously observed in the postcoalescence regime. We have also observed that less than a tenth of a monolayer of deposition leads to an instantaneous stress of order 1 GPa. The stress changes in both the precoalescence and postcoalescence regimes of growth are explained by changes in the adatom population during and after deposition.

Original languageEnglish (US)
JournalPhysical Review Letters
Volume89
Issue number12
DOIs
StatePublished - Jan 1 2002
Externally publishedYes

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ASJC Scopus subject areas

  • Physics and Astronomy(all)

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