TY - GEN
T1 - On the study of skin-effect and dispersion of heavily lossy transmission lines
AU - Pan, G.
AU - Zhu, X.
AU - Wang, B.
AU - Gilbert, B.
PY - 1992/1/1
Y1 - 1992/1/1
N2 - A special case of a circular coaxial cable with heavy conduction loss was studied by full-wave analysis, and compared with the quasi-transverse electromagnetic (TEM) solutions. It was found that at high frequencies the tangential electrical fields will be much greater than the values reported in the literature. Despite relatively strong longitudinal E-fields and radial currents, the comparison revealed that, provided the circuit parameters are properly evaluated, the errors introduced by a simple distributed circuit model under the quasi-TEM assumption are not excessively large. Therefore, the telegraphist's equations may give good results up to frequencies of 10 GHz or higher for transmission lines of small geometries commonly found in microelectronics packaging. A second case of three coupled microstrips of rectangular cross-section was also analyzed and compared with network measurements. It was found that the dispersion occurring in microelectronics packaging interconnects at frequencies up to the microwave band is anomalous.
AB - A special case of a circular coaxial cable with heavy conduction loss was studied by full-wave analysis, and compared with the quasi-transverse electromagnetic (TEM) solutions. It was found that at high frequencies the tangential electrical fields will be much greater than the values reported in the literature. Despite relatively strong longitudinal E-fields and radial currents, the comparison revealed that, provided the circuit parameters are properly evaluated, the errors introduced by a simple distributed circuit model under the quasi-TEM assumption are not excessively large. Therefore, the telegraphist's equations may give good results up to frequencies of 10 GHz or higher for transmission lines of small geometries commonly found in microelectronics packaging. A second case of three coupled microstrips of rectangular cross-section was also analyzed and compared with network measurements. It was found that the dispersion occurring in microelectronics packaging interconnects at frequencies up to the microwave band is anomalous.
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U2 - 10.1109/MCMC.1992.201447
DO - 10.1109/MCMC.1992.201447
M3 - Conference contribution
AN - SCOPUS:84939345010
T3 - Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92
SP - 60
EP - 63
BT - Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 1992 IEEE Multi-Chip Module Conference, MCMC 1992
Y2 - 18 March 1992 through 20 March 1992
ER -