Non-contact probes for on-wafer characterization of sub-millimeter-wave devices and integrated circuits

Cosan Caglayan, Georgios C. Trichopoulos, Kubilay Sertel

Research output: Contribution to journalArticle

27 Scopus citations

Abstract

We present a novel non-contact metrology approach for on-wafer characterization of sub-millimeter-wave devices, components, and integrated circuits. Unlike existing contact probes that rely on small metallic tips that make physical contact with the device on the chip, the new non-contact probes are based on electromagnetic coupling of vector network analyzer (VNA) test ports into the coplanar waveguide environment of integrated devices and circuits. Efficient signal coupling is achieved via a quasi-optical link between the VNA ports and planar antennas that are monolithically integrated with the test device. Experimental validation of the non-contact device metrology system is presented for the first time to demonstrate the accuracy and repeatability of proposed approach for the 325-500-GHz (WR2.2) and 500-750-GHz (WR1.5) bands.

Original languageEnglish (US)
Article number6901300
Pages (from-to)2791-2801
Number of pages11
JournalIEEE Transactions on Microwave Theory and Techniques
Volume62
Issue number11
DOIs
StatePublished - Nov 1 2014
Externally publishedYes

Keywords

  • Measurement techniques
  • millimeter-wave (mmW) measurements
  • mmW technology
  • sub-mmW measurements
  • sub-mmW propagation
  • sub-mmW technology

ASJC Scopus subject areas

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Non-contact probes for on-wafer characterization of sub-millimeter-wave devices and integrated circuits'. Together they form a unique fingerprint.

  • Cite this