Nanopore patterning using Al<inf>2</inf>O<inf>3</inf> hard masks on SOI substrates

Engineering & Materials Science

• Nanopores 100%
• Aluminum oxide 64%
• Masks 63%
• Silicon 53%
• Substrates 47%
• Plasmas 20%
• Nanofluidics 18%
• Atomic layer deposition 17%
• Inductively coupled plasma 16%
• Plasma etching 16%
• Dry etching 16%
• Reactive ion etching 15%
• Chlorine 13%
• Etching 12%
• Anisotropy 11%
• Alumina 11%
• Thin films 10%
• Aspect ratio 10%
• Oxides 9%
• Gases 6%

Chemical Compounds

• Etching 60%
• Plasma 27%
• Chemistry 26%
• Atomic Layer Epitaxy 25%
• Inductively Coupled Plasma 22%
• Anisotropy 21%
• Chlorine 19%
• Dimension 16%
• Amorphous Material 15%
• Oxide 12%
• Gas 11%
• Mixture 9%
• Ion 8%