TY - JOUR
T1 - Modeling fracture of sn-rich (Pb-Free) solder joints under mechanical shock conditions
AU - Fei, Huiyang
AU - Yazzie, Kyle
AU - Chawla, Nikhilesh
AU - Jiang, Hanqing
N1 - Funding Information:
The authors are grateful for financial support for this work from the National Science Foundation, Division of Materials Research—Metals Division, DMR-0805144 (Drs. A. Ardell, B. Macdonald, and H. Chopra, Program Managers). We also appreciate the Fulton High Performance Computing at Arizona State University for support of our simulations.
PY - 2012/8
Y1 - 2012/8
N2 - With the increasing focus on developing environmentally benign electronic packages, lead-free solder alloys have received a great deal of attention. Mishandling of packages during manufacture, assembly, or by the user may cause solder joint failure. In this work, we conducted finite-element analysis to model solder joint fracture under dynamic loading conditions. The solder is modeled as a porous plastic material, and the intermetallic compound (IMC) material is characterized as an elastic material. The fracture of the solder is governed by void nucleation, and the IMC fracture is brittle in nature. The randomness of the void volume fraction in the solder and the defects in the IMC are considered and implemented in the finite-element package ABAQUS. The finite-element results show that the fracture mechanisms of the solder joints depend on the strain rate and IMC thickness. High strain rate and larger IMC thickness favor IMC-controlled fracture, which is brittle in nature. Low strain rate and smaller IMC thickness lead to solder-controlled fracture, which is governed by void growth and nucleation. Based on this finding, a mechanistic explanation for solder joint fracture is suggested.
AB - With the increasing focus on developing environmentally benign electronic packages, lead-free solder alloys have received a great deal of attention. Mishandling of packages during manufacture, assembly, or by the user may cause solder joint failure. In this work, we conducted finite-element analysis to model solder joint fracture under dynamic loading conditions. The solder is modeled as a porous plastic material, and the intermetallic compound (IMC) material is characterized as an elastic material. The fracture of the solder is governed by void nucleation, and the IMC fracture is brittle in nature. The randomness of the void volume fraction in the solder and the defects in the IMC are considered and implemented in the finite-element package ABAQUS. The finite-element results show that the fracture mechanisms of the solder joints depend on the strain rate and IMC thickness. High strain rate and larger IMC thickness favor IMC-controlled fracture, which is brittle in nature. Low strain rate and smaller IMC thickness lead to solder-controlled fracture, which is governed by void growth and nucleation. Based on this finding, a mechanistic explanation for solder joint fracture is suggested.
KW - Lead-free solder joint
KW - brittle fracture
KW - porous plasticity
KW - strain rate
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U2 - 10.1007/s11664-012-2079-5
DO - 10.1007/s11664-012-2079-5
M3 - Article
AN - SCOPUS:84865411340
SN - 0361-5235
VL - 41
SP - 2089
EP - 2099
JO - Journal of Electronic Materials
JF - Journal of Electronic Materials
IS - 8
ER -