Microstructural characterization of dispersion-strengthened Cu-Ti-Al alloys obtained by reaction milling

Rodrigo A. Espinoza, Rodrigo H. Palma, Aquiles O. Sepúlveda, Víctor Fuenzalida, Guillermo Solórzano, Aldo Craievich, David Smith, Takeshi Fujita, Marta López

Research output: Contribution to journalArticlepeer-review

16 Scopus citations

Abstract

The microstructure, electrical conductivity and hot softening resistance of two alloys (G-10 and H-20), projected to attain Cu-2.5 vol.% TiC-2.5 vol.% Al2O3 nominal composition, and prepared by reaction milling and hot extrusion, were studied. The alloys were characterized by scanning electron microscopy (SEM), transmission electron microscopy (TEM), X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS) and several chemical analysis techniques. The first alloy, G-10, showed the formation of Al2O3 nanodispersoids and the presence of particles from non-reacted raw materials (graphite, Ti and Al). A second alloy, H-20, was prepared employing different fabrication conditions. This alloy exhibited a homogeneous distribution of Al2O3 and Ti-Al-Fe nanoparticles, with the microstructure being stable after annealing and hot compression tests. These nanoparticles acted as effective pinning sites for dislocation slip and grain growth. The room-temperature hardness of the H-20 consolidated material (330 HV) was approximately maintained after annealing for 1 h at 1173 K; the electrical conductivity was 60% IACS (International Annealing Copper Standard).

Original languageEnglish (US)
Pages (from-to)183-193
Number of pages11
JournalMaterials Science and Engineering A
Volume454-455
DOIs
StatePublished - Apr 25 2007

Keywords

  • Copper alloys
  • Creep
  • Dispersion strengthening
  • Mechanical alloying
  • Nanoparticles
  • Reaction milling

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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