TY - JOUR
T1 - Microstructural characterization of dispersion-strengthened Cu-Ti-Al alloys obtained by reaction milling
AU - Espinoza, Rodrigo A.
AU - Palma, Rodrigo H.
AU - Sepúlveda, Aquiles O.
AU - Fuenzalida, Víctor
AU - Solórzano, Guillermo
AU - Craievich, Aldo
AU - Smith, David
AU - Fujita, Takeshi
AU - López, Marta
N1 - Funding Information:
The authors acknowledge the financial support of project Fondecyt No. 1011024. R. Espinoza acknowledges Conicyt for the scholarship and financial support for his Doctoral Thesis. They thank Prof. A. Zárate (U. Católica del Norte) and PhD student D. Díaz (U. de Chile) for their assistance with XPS analysis. Moreover, they gratefully thank to ECKA Granulate Micromet GmbII for providing part of the Cu powders used in this study, to Laboratório Nacional de Luz Síncrotron (LNLA, Campinas, Brazil) for its full cooperation in XRD analysis, to JEOL Company Laboratories in Tokyo for TEM support, and to FEI Company in Eindhoven for FIB microscopy support. We acknowledge use of facilities at the John M. Cowley Center for High Resolution Electron Microscopy at Arizona State University, and partial support from NSF Grant DMR-030342.
PY - 2007/4/25
Y1 - 2007/4/25
N2 - The microstructure, electrical conductivity and hot softening resistance of two alloys (G-10 and H-20), projected to attain Cu-2.5 vol.% TiC-2.5 vol.% Al2O3 nominal composition, and prepared by reaction milling and hot extrusion, were studied. The alloys were characterized by scanning electron microscopy (SEM), transmission electron microscopy (TEM), X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS) and several chemical analysis techniques. The first alloy, G-10, showed the formation of Al2O3 nanodispersoids and the presence of particles from non-reacted raw materials (graphite, Ti and Al). A second alloy, H-20, was prepared employing different fabrication conditions. This alloy exhibited a homogeneous distribution of Al2O3 and Ti-Al-Fe nanoparticles, with the microstructure being stable after annealing and hot compression tests. These nanoparticles acted as effective pinning sites for dislocation slip and grain growth. The room-temperature hardness of the H-20 consolidated material (330 HV) was approximately maintained after annealing for 1 h at 1173 K; the electrical conductivity was 60% IACS (International Annealing Copper Standard).
AB - The microstructure, electrical conductivity and hot softening resistance of two alloys (G-10 and H-20), projected to attain Cu-2.5 vol.% TiC-2.5 vol.% Al2O3 nominal composition, and prepared by reaction milling and hot extrusion, were studied. The alloys were characterized by scanning electron microscopy (SEM), transmission electron microscopy (TEM), X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS) and several chemical analysis techniques. The first alloy, G-10, showed the formation of Al2O3 nanodispersoids and the presence of particles from non-reacted raw materials (graphite, Ti and Al). A second alloy, H-20, was prepared employing different fabrication conditions. This alloy exhibited a homogeneous distribution of Al2O3 and Ti-Al-Fe nanoparticles, with the microstructure being stable after annealing and hot compression tests. These nanoparticles acted as effective pinning sites for dislocation slip and grain growth. The room-temperature hardness of the H-20 consolidated material (330 HV) was approximately maintained after annealing for 1 h at 1173 K; the electrical conductivity was 60% IACS (International Annealing Copper Standard).
KW - Copper alloys
KW - Creep
KW - Dispersion strengthening
KW - Mechanical alloying
KW - Nanoparticles
KW - Reaction milling
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U2 - 10.1016/j.msea.2006.11.042
DO - 10.1016/j.msea.2006.11.042
M3 - Article
AN - SCOPUS:33947239370
SN - 0921-5093
VL - 454-455
SP - 183
EP - 193
JO - Materials Science and Engineering A
JF - Materials Science and Engineering A
ER -