TY - GEN
T1 - MEMS-based testing stage to study electrical and mechanical properties of nanocrystalline metal films
AU - Han, Jong H.
AU - Rajagopalan, Jagannathan
AU - Saif, M. Taher A.
PY - 2007/5/22
Y1 - 2007/5/22
N2 - We have developed a MEMS-based testing stage that can quantitatively characterize both the electrical and mechanical properties of nanocrystalline metal films. This stage, which is SEM and TEM compatible, is a modified version of an earlier MEMS-based tensile testing stage (M. A. Haque and M. T. A. Saif, Proc. Natl. Acad Sci., 101(17), 6335-6340 (2004)). This modified stage requires a simpler fabrication procedure, involving less lithography and etching steps, and has higher sample yield compared to the earlier version. It allows for 4-point electrical resistivity measurement, and insitu tensile testing in SEM and TEM of free-standing nano-scale metal films. The stage was used to perform a tensile test and electrical resistivity measurement on 100-nm-thick aluminum films, the results of which are described.
AB - We have developed a MEMS-based testing stage that can quantitatively characterize both the electrical and mechanical properties of nanocrystalline metal films. This stage, which is SEM and TEM compatible, is a modified version of an earlier MEMS-based tensile testing stage (M. A. Haque and M. T. A. Saif, Proc. Natl. Acad Sci., 101(17), 6335-6340 (2004)). This modified stage requires a simpler fabrication procedure, involving less lithography and etching steps, and has higher sample yield compared to the earlier version. It allows for 4-point electrical resistivity measurement, and insitu tensile testing in SEM and TEM of free-standing nano-scale metal films. The stage was used to perform a tensile test and electrical resistivity measurement on 100-nm-thick aluminum films, the results of which are described.
KW - Aluminum
KW - Electrical resistivity
KW - In-situ uniaxial tensile
KW - MEMS
KW - Nanocrystalline
KW - SEM
KW - TEM
UR - http://www.scopus.com/inward/record.url?scp=34248551443&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=34248551443&partnerID=8YFLogxK
U2 - 10.1117/12.706115
DO - 10.1117/12.706115
M3 - Conference contribution
AN - SCOPUS:34248551443
SN - 0819465771
SN - 9780819465771
T3 - Proceedings of SPIE - The International Society for Optical Engineering
BT - MEMS/MOEMS Components and Their Applications IV
T2 - MEMS/MOEMS Components and Their Applications IV
Y2 - 22 January 2007 through 23 January 2007
ER -