TY - JOUR
T1 - Low-voltage shock-mitigated micro-electromechanical systems structure
AU - Chen, Ang
AU - Nam, Suhyun
AU - Lai, Ying-Cheng
AU - Chae, Junseok
N1 - Funding Information:
The authors appreciate the support from National Science Foundation (ECCS-1101797).
Publisher Copyright:
© 2017 Author(s).
PY - 2017/5/15
Y1 - 2017/5/15
N2 - We report a low-voltage, yet effective, micro-electromechanical systems (MEMS) structure capable of mitigating external mechanical disturbances, such as a physical shock. External shock onto MEMS devices can be catastrophic as a conventional single membrane may travel beyond stable oscillatory distances under shock and become irreparably damaged. However, the simple addition of a second membrane on top of the single membrane drastically reduces oscillatory distances by electrostatically holding the bottom membrane within stable oscillation. The added elements, in conjunction with a fine-control algorithm, mitigate the impact of a mechanical shock onto the MEMS device. From experimental findings, it is found that the dual-membrane structure effectively reduces the travel distance of the bottom membrane by 41.5%, upon deploying merely 0.565 V onto the additional membrane. The dynamic implementation of the shock mitigation method, using an on-board accelerometer as a trigger, delivered in-situ mitigation of shock on a dual-membrane MEMS structure.
AB - We report a low-voltage, yet effective, micro-electromechanical systems (MEMS) structure capable of mitigating external mechanical disturbances, such as a physical shock. External shock onto MEMS devices can be catastrophic as a conventional single membrane may travel beyond stable oscillatory distances under shock and become irreparably damaged. However, the simple addition of a second membrane on top of the single membrane drastically reduces oscillatory distances by electrostatically holding the bottom membrane within stable oscillation. The added elements, in conjunction with a fine-control algorithm, mitigate the impact of a mechanical shock onto the MEMS device. From experimental findings, it is found that the dual-membrane structure effectively reduces the travel distance of the bottom membrane by 41.5%, upon deploying merely 0.565 V onto the additional membrane. The dynamic implementation of the shock mitigation method, using an on-board accelerometer as a trigger, delivered in-situ mitigation of shock on a dual-membrane MEMS structure.
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U2 - 10.1063/1.4983645
DO - 10.1063/1.4983645
M3 - Article
AN - SCOPUS:85019410303
SN - 0003-6951
VL - 110
JO - Applied Physics Letters
JF - Applied Physics Letters
IS - 20
M1 - 201903
ER -