TY - JOUR
T1 - Is SOD technology the solution to heating problems in SOI devices?
AU - Raleva, Katerina
AU - Vasileska, Dragica
AU - Goodnick, Stephen
N1 - Funding Information:
Manuscript received January 10, 2008; revised February 8, 2008. This work was supported in part by the Arizona Institute for Nano-Electronics (AINE). The review of this letter was arranged by Editor X. Zhou. K. Raleva is with FEIT, University of Kiril and Metodi, 1000 Skopje, Macedonia. D. Vasileska and S. M. Goodnick are with Arizona State University, Tempe, AZ 85287 USA (e-mail: vasileska@asu.edu). Color versions of one or more of the figures in this letter are available online at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/LED.2008.920756
PY - 2008/6
Y1 - 2008/6
N2 - In this letter, we present our investigations on heating effects in Si on diamond and Si on AlN transistors, using a coupled Monte Carlo/ thermal moment expansion simulator. Both technologies are considered viable alternatives to silicon-on-insulator devices due to the fact that diamond and AlN have significantly higher thermal conductivities than SiO2. This fact is beneficial in the following two aspects, as demonstrated in this letter: 1) It leads to a significant reduction in the thermal degradation of the device electrical characteristics, and 2) it allows a more uniform distribution of temperature in the device active region, which, in turn, enhances heat removal.
AB - In this letter, we present our investigations on heating effects in Si on diamond and Si on AlN transistors, using a coupled Monte Carlo/ thermal moment expansion simulator. Both technologies are considered viable alternatives to silicon-on-insulator devices due to the fact that diamond and AlN have significantly higher thermal conductivities than SiO2. This fact is beneficial in the following two aspects, as demonstrated in this letter: 1) It leads to a significant reduction in the thermal degradation of the device electrical characteristics, and 2) it allows a more uniform distribution of temperature in the device active region, which, in turn, enhances heat removal.
KW - Electrothermal effects
KW - Modeling and simulation
KW - Particle-based device simulation
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U2 - 10.1109/LED.2008.920756
DO - 10.1109/LED.2008.920756
M3 - Article
AN - SCOPUS:44849123670
SN - 0741-3106
VL - 29
SP - 621
EP - 624
JO - IEEE Electron Device Letters
JF - IEEE Electron Device Letters
IS - 6
ER -