Influence of Initial Morphology and Thickness of Cu6Sn 5 and Cu3Sn Intermetallics on Growth and Evolution during Thermal Aging of Sn-Ag Solder/Cu Joints

X. Deng, G. Piotrowski, J. J. Williams, Nikhilesh Chawla

Research output: Contribution to journal › Article › peer-review

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