TY - GEN
T1 - Improved method to evaluate the adhesion properties of thin film conformal coatings
AU - Hildreth, Owen
AU - Wong, C. P.
PY - 2009/10/12
Y1 - 2009/10/12
N2 - Conformal coatings are widely used by the electronics industry to protect sensitive equipment from moisture and corrosion [i]. Of these, parylene thin-film coatings have many material properties such as low dielectric and dissipation factors, high operating temperatures, excellent conformability and low moisture permeability, which make them an attractive conformal material for numerous applications. However, adhesion of parylene coatings is critical to the overall reliability of the coating and is especially problematic on inorganic surfaces. A number of techniques can potentially improve adhesion including adhesion promoters and plasma treatment, but a robust method for evaluating adhesion has been lacking. In response, we developed a method based upon a standard dieshear test that can calculate the adhesion strength of different interfaces when multiple failure modes are active. This process uses pre-shear and post-shear images to calculate the area of each failure mode. Those areas are then used in combination with the measured breaking load to calculate the adhesion strength of the different interfaces using an iterative solver. This method provides an accurate, quantitative measure of thin-film adhesion even when mixed failuremodes are active.
AB - Conformal coatings are widely used by the electronics industry to protect sensitive equipment from moisture and corrosion [i]. Of these, parylene thin-film coatings have many material properties such as low dielectric and dissipation factors, high operating temperatures, excellent conformability and low moisture permeability, which make them an attractive conformal material for numerous applications. However, adhesion of parylene coatings is critical to the overall reliability of the coating and is especially problematic on inorganic surfaces. A number of techniques can potentially improve adhesion including adhesion promoters and plasma treatment, but a robust method for evaluating adhesion has been lacking. In response, we developed a method based upon a standard dieshear test that can calculate the adhesion strength of different interfaces when multiple failure modes are active. This process uses pre-shear and post-shear images to calculate the area of each failure mode. Those areas are then used in combination with the measured breaking load to calculate the adhesion strength of the different interfaces using an iterative solver. This method provides an accurate, quantitative measure of thin-film adhesion even when mixed failuremodes are active.
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U2 - 10.1109/ECTC.2009.5074305
DO - 10.1109/ECTC.2009.5074305
M3 - Conference contribution
AN - SCOPUS:70349656027
SN - 9781424444762
T3 - Proceedings - Electronic Components and Technology Conference
SP - 2051
EP - 2054
BT - 2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009
T2 - 2009 59th Electronic Components and Technology Conference, ECTC 2009
Y2 - 26 May 2009 through 29 May 2009
ER -