High spatial resolution tem study of thin film metal/6h-SIC interfaces

J. S. Bow, L. M. Porter, M. J. Kim, Ray Carpenter, R. F. Davis

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

Thin films of titanium, platinum, and hafnium were deposited on single crystal n-type, (0001) 6H-SiC at room temperature in UHV. Microstructure and chemistry of their interfaces were analyzed by high spatial resolution TEM imaging and spectroscopy. Ti5Si3 and TiC were the two phases found in the reaction zone of Ti/SiC specimens annealed at 700°C. A carbon-containing amorphous layer formed between Pt and SiC when the annealing temperature went up to 750°C. There was no apparent reaction zone in Hf/SiC specimens annealed at 700°C for 60 min.. The change of electrical properties of metal/6H-SiC devices was attributed to these new product phases.

Original languageEnglish (US)
Title of host publicationEvolution of Surface and Thin Film Microstructure
EditorsHarry A. Atwater, Eric Chason, Marcia H. Grabow, Max G. Lagally
PublisherPubl by Materials Research Society
Pages571-576
Number of pages6
ISBN (Print)1558991751
StatePublished - Dec 1 1993
EventProceedings of the 1992 Fall Meeting of the Materials Research Society - Boston, MA, USA
Duration: Nov 30 1992Dec 4 1992

Publication series

NameMaterials Research Society Symposium Proceedings
Volume280
ISSN (Print)0272-9172

Other

OtherProceedings of the 1992 Fall Meeting of the Materials Research Society
CityBoston, MA, USA
Period11/30/9212/4/92

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ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Bow, J. S., Porter, L. M., Kim, M. J., Carpenter, R., & Davis, R. F. (1993). High spatial resolution tem study of thin film metal/6h-SIC interfaces. In H. A. Atwater, E. Chason, M. H. Grabow, & M. G. Lagally (Eds.), Evolution of Surface and Thin Film Microstructure (pp. 571-576). (Materials Research Society Symposium Proceedings; Vol. 280). Publ by Materials Research Society.