Flip-chip bonding of VCSEL arrays with silicon driver chips for high speed data links

U. Koelle, Shane Johnson, P. Kelkar, R. Turpin, P. Dowd, George Pan, Yong-Hang Zhang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

An 8×8 vertical cavity surface emitting laser array flip-chip bonded to dummy silicon chip that mimics the real CMOS driver IC is demonstrated using Al metal lines and contact pads. All bonded devices operated reliably, showing only a small variation in wavelength, threshold current and power output across the array. Devices were digitally modulated up to 800 Mbit/s without degradation of the eye opening. The very high bonding yield and high frequency modulation of the bonded array show the applicability of the bonding technique for the integration of VCSEL arrays with high speed Si-based CMOS driver ICs for high speed data communications through optical interconnects.

Original languageEnglish (US)
Title of host publicationConference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS
PublisherIEEE
Pages166-167
Number of pages2
Volume1
StatePublished - 1998
EventProceedings of the 1998 11th Annual Meeting IEEE Lasers and Electro-Optics Society, LEOS. Part 2 (of 2) - Orlando, FL, USA
Duration: Dec 1 1998Dec 4 1998

Other

OtherProceedings of the 1998 11th Annual Meeting IEEE Lasers and Electro-Optics Society, LEOS. Part 2 (of 2)
CityOrlando, FL, USA
Period12/1/9812/4/98

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering

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    Koelle, U., Johnson, S., Kelkar, P., Turpin, R., Dowd, P., Pan, G., & Zhang, Y-H. (1998). Flip-chip bonding of VCSEL arrays with silicon driver chips for high speed data links. In Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS (Vol. 1, pp. 166-167). IEEE.