Flip-chip bonding of VCSEL arrays with silicon driver chips for high speed data links

U. Koelle; Shane Johnson; P. Kelkar; R. Turpin; P. Dowd; George Pan; Yong-Hang Zhang

Flip-chip bonding of VCSEL arrays with silicon driver chips for high speed data links

U. Koelle, Shane Johnson, P. Kelkar, R. Turpin, P. Dowd, George Pan, Yong-Hang Zhang

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

An 8×8 vertical cavity surface emitting laser array flip-chip bonded to dummy silicon chip that mimics the real CMOS driver IC is demonstrated using Al metal lines and contact pads. All bonded devices operated reliably, showing only a small variation in wavelength, threshold current and power output across the array. Devices were digitally modulated up to 800 Mbit/s without degradation of the eye opening. The very high bonding yield and high frequency modulation of the bonded array show the applicability of the bonding technique for the integration of VCSEL arrays with high speed Si-based CMOS driver ICs for high speed data communications through optical interconnects.

Original language	English (US)
Title of host publication	Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS
Publisher	IEEE
Pages	166-167
Number of pages	2
Volume	1
State	Published - 1998
Event	Proceedings of the 1998 11th Annual Meeting IEEE Lasers and Electro-Optics Society, LEOS. Part 2 (of 2) - Orlando, FL, USA Duration: Dec 1 1998 → Dec 4 1998

Other

Other	Proceedings of the 1998 11th Annual Meeting IEEE Lasers and Electro-Optics Society, LEOS. Part 2 (of 2)
City	Orlando, FL, USA
Period	12/1/98 → 12/4/98

ASJC Scopus subject areas

Control and Systems Engineering
Electrical and Electronic Engineering
Industrial and Manufacturing Engineering

Cite this

Koelle, U, Johnson, S, Kelkar, P, Turpin, R, Dowd, P, Pan, G & Zhang, Y-H 1998, Flip-chip bonding of VCSEL arrays with silicon driver chips for high speed data links. in Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS. vol. 1, IEEE, pp. 166-167, Proceedings of the 1998 11th Annual Meeting IEEE Lasers and Electro-Optics Society, LEOS. Part 2 (of 2), Orlando, FL, USA, 12/1/98.

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abstract = "An 8×8 vertical cavity surface emitting laser array flip-chip bonded to dummy silicon chip that mimics the real CMOS driver IC is demonstrated using Al metal lines and contact pads. All bonded devices operated reliably, showing only a small variation in wavelength, threshold current and power output across the array. Devices were digitally modulated up to 800 Mbit/s without degradation of the eye opening. The very high bonding yield and high frequency modulation of the bonded array show the applicability of the bonding technique for the integration of VCSEL arrays with high speed Si-based CMOS driver ICs for high speed data communications through optical interconnects.",

author = "U. Koelle and Shane Johnson and P. Kelkar and R. Turpin and P. Dowd and George Pan and Yong-Hang Zhang",

year = "1998",

language = "English (US)",

volume = "1",

pages = "166--167",

booktitle = "Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS",

publisher = "IEEE",

note = "Proceedings of the 1998 11th Annual Meeting IEEE Lasers and Electro-Optics Society, LEOS. Part 2 (of 2) ; Conference date: 01-12-1998 Through 04-12-1998",

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T1 - Flip-chip bonding of VCSEL arrays with silicon driver chips for high speed data links

AU - Koelle, U.

AU - Johnson, Shane

AU - Kelkar, P.

AU - Turpin, R.

AU - Dowd, P.

AU - Pan, George

AU - Zhang, Yong-Hang

PY - 1998

Y1 - 1998

N2 - An 8×8 vertical cavity surface emitting laser array flip-chip bonded to dummy silicon chip that mimics the real CMOS driver IC is demonstrated using Al metal lines and contact pads. All bonded devices operated reliably, showing only a small variation in wavelength, threshold current and power output across the array. Devices were digitally modulated up to 800 Mbit/s without degradation of the eye opening. The very high bonding yield and high frequency modulation of the bonded array show the applicability of the bonding technique for the integration of VCSEL arrays with high speed Si-based CMOS driver ICs for high speed data communications through optical interconnects.

AB - An 8×8 vertical cavity surface emitting laser array flip-chip bonded to dummy silicon chip that mimics the real CMOS driver IC is demonstrated using Al metal lines and contact pads. All bonded devices operated reliably, showing only a small variation in wavelength, threshold current and power output across the array. Devices were digitally modulated up to 800 Mbit/s without degradation of the eye opening. The very high bonding yield and high frequency modulation of the bonded array show the applicability of the bonding technique for the integration of VCSEL arrays with high speed Si-based CMOS driver ICs for high speed data communications through optical interconnects.

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M3 - Conference contribution

AN - SCOPUS:0032304497

VL - 1

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EP - 167

BT - Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS

PB - IEEE

T2 - Proceedings of the 1998 11th Annual Meeting IEEE Lasers and Electro-Optics Society, LEOS. Part 2 (of 2)

Y2 - 1 December 1998 through 4 December 1998

ER -

Flip-chip bonding of VCSEL arrays with silicon driver chips for high speed data links

Abstract

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ASJC Scopus subject areas

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