Film/substrate thermal boundary resistance for an Er-Ba-Cu-O high-Tc superconducting film

P. E. Phelan, O. Nakabeppu, K. Ito, K. Hijikata, T. Ohmori

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Scopus citations


The thermal boundary resistance, Rbd, at the film/substrate interface is crucially important to the thermal design of electronic and opto-electronic devices made from high-Tc superconducting thin films. Direct measurement of Rbd, however, has been limited to temperatures well above the boiling point of nitrogen, or out of the likely operating range of high-Tc devices. Here, an experiment is carried out on an Er-Ba-Cu-O thin film deposited on an MgO substrate, in which the film is etched into a double meander pattern consisting of two adjacent high-Tc strips. One strip is used as the heater, while the other is used to determine the substrate temperature. In general, the measured values of Rbd are far above those reported earlier; however, due to uncertainties in the temperature determination of the heater strip caused by its current-dependent resistance, much of the data is suspect. The most reliable data indicate that Rbd≈0.1 K cm2 W-1 at ≈100 K. Furthermore, the data suggest that Rbd may be a function of the heat flux.

Original languageEnglish (US)
Title of host publicationHeat Transfer in Superconducting Equipment
PublisherPubl by ASME
Number of pages6
ISBN (Print)0791810771
StatePublished - Dec 1 1992
Externally publishedYes
EventWinter Annual Meeting of the American Society of Mechanical Engineers - Anaheim, CA, USA
Duration: Nov 8 1992Nov 13 1992

Publication series

NameAmerican Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD
ISSN (Print)0272-5673


OtherWinter Annual Meeting of the American Society of Mechanical Engineers
CityAnaheim, CA, USA

ASJC Scopus subject areas

  • Mechanical Engineering
  • Fluid Flow and Transfer Processes


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