Failure mechanisms of pure silver, pure aluminum and silver-aluminum alloy under high current stress

Engineering & Materials Science

• Silver alloys 100%
• Metallizing 72%
• Silver 67%
• Aluminum alloys 54%
• Aluminum 48%
• Titanium nitride 29%
• Joule heating 26%
• Vaporization 23%
• Current density 20%
• Linewidth 13%
• Topography 11%
• Electric fuses 10%
• Thermal stress 10%
• Thin films 9%
• Field programmable gate arrays (FPGA) 8%
• Scanning electron microscopy 8%
• Microstructure 6%

Physics & Astronomy

• silver alloys 86%
• aluminum alloys 57%
• high current 56%
• silver 51%
• aluminum 42%
• titanium nitrides 30%
• Joule heating 28%
• current density 17%
• field-programmable gate arrays 16%
• fuses 16%
• thermal stresses 13%
• topography 11%
• scanning electron microscopy 8%
• microstructure 7%
• thin films 6%

Chemical Compounds

• Vaporization 63%
• Nitride 60%
• Current Density 45%
• Alloy 43%
• Purity 31%
• Microstructure 21%
• Scanning Electron Microscopy 18%
• Time 11%
• Application 9%