Abstract
The objective of the concept of T-type Modular Multilevel Converter (TMMC) is to improve the power density of the traditional Modular Multilevel Converter (MMC) exploited in medium voltage motor drive. The size of the major volume contributor 'capacitor' can be reduced by 30%∼40% with the proposed circuit operating at only half dc link voltage at low frequency low voltage region, which is enabled by an extra full bridge arm inserted between the middle point of the dc and the terminal of the output in each phase leg. It is also found to be a topology that is optimized for usage of SiC device because of its zero requirement for device serialization and its modest dv/dt and di/dt level.
| Original language | English (US) |
|---|---|
| Title of host publication | Proceedings IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 1133-1139 |
| Number of pages | 7 |
| Volume | 2017-January |
| ISBN (Electronic) | 9781538611272 |
| DOIs | |
| State | Published - Dec 15 2017 |
| Event | 43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017 - Beijing, China Duration: Oct 29 2017 → Nov 1 2017 |
Other
| Other | 43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017 |
|---|---|
| Country/Territory | China |
| City | Beijing |
| Period | 10/29/17 → 11/1/17 |
Keywords
- power density
- SiC device
- TMMC
ASJC Scopus subject areas
- Industrial and Manufacturing Engineering
- Control and Optimization
- Energy Engineering and Power Technology
- Electrical and Electronic Engineering