Extreme high power density T-modular-multilevel-converter for medium voltage motor drive

Qin Lei, Yifu Liu, Yunpeng Si

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

The objective of the concept of T-type Modular Multilevel Converter (TMMC) is to improve the power density of the traditional Modular Multilevel Converter (MMC) exploited in medium voltage motor drive. The size of the major volume contributor 'capacitor' can be reduced by 30%∼40% with the proposed circuit operating at only half dc link voltage at low frequency low voltage region, which is enabled by an extra full bridge arm inserted between the middle point of the dc and the terminal of the output in each phase leg. It is also found to be a topology that is optimized for usage of SiC device because of its zero requirement for device serialization and its modest dv/dt and di/dt level.

Original languageEnglish (US)
Title of host publicationProceedings IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1133-1139
Number of pages7
Volume2017-January
ISBN (Electronic)9781538611272
DOIs
StatePublished - Dec 15 2017
Event43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017 - Beijing, China
Duration: Oct 29 2017Nov 1 2017

Other

Other43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017
CountryChina
CityBeijing
Period10/29/1711/1/17

Keywords

  • power density
  • SiC device
  • TMMC

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Control and Optimization
  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering

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  • Cite this

    Lei, Q., Liu, Y., & Si, Y. (2017). Extreme high power density T-modular-multilevel-converter for medium voltage motor drive. In Proceedings IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society (Vol. 2017-January, pp. 1133-1139). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IECON.2017.8216194