Electroplated Al as the front electrode in crystalline-Si solar cells

Wen Cheng Sun; Haifeng Zhang; Laidong Wang; Clarence J. Tracy; Meng Tao

doi:10.1109/PVSC.2015.7355874

Electroplated Al as the front electrode in crystalline-Si solar cells

Wen Cheng Sun, Haifeng Zhang, Laidong Wang, Clarence J. Tracy, Meng Tao

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

5 Scopus citations

Abstract

This paper reports aluminum (Al) electroplating as the metallization technique for the front finger electrode on n-type silicon (Si) in crystalline-Si solar cells. The development of the Al electroplating process is motivated by the limited reserves of silver (Ag) on this planet and the industry-wide push to reduce Ag usage for cost control. The new metallization process consists of: 1) patterning the silicon nitride (SiNx) layer for front electrode; 2) depositing a nickel (Ni) seed layer into the opening; 3) electroplating self-aligned Al onto the Ni seed layer and 4) annealing the Al/Ni electrode in air at ∼200°C. This temperature is far below the typical firing temperatures for commercial Al pastes. The new metallization process has been integrated into commercial p-type monocrystalline Si solar cells from Hareon Solar. An all-Al Si solar cell, with an electroplated Al front electrode and a screen-printed Al back electrode, has been demonstrated. The cell has a size of 2.54×2.54 cm2, with efficiencies approaching 15% demonstrated.

Original language	English (US)
Title of host publication	2015 IEEE 42nd Photovoltaic Specialist Conference, PVSC 2015
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Print)	9781479979448
DOIs	https://doi.org/10.1109/PVSC.2015.7355874
State	Published - Dec 14 2015
Event	42nd IEEE Photovoltaic Specialist Conference, PVSC 2015 - New Orleans, United States Duration: Jun 14 2015 → Jun 19 2015

Other

Other	42nd IEEE Photovoltaic Specialist Conference, PVSC 2015
Country/Territory	United States
City	New Orleans
Period	6/14/15 → 6/19/15

Keywords

aluminum
electroplating
metallization
silicon solar cell
silver

ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/PVSC.2015.7355874

Cite this

Sun, WC, Zhang, H, Wang, L, Tracy, CJ & Tao, M 2015, Electroplated Al as the front electrode in crystalline-Si solar cells. in 2015 IEEE 42nd Photovoltaic Specialist Conference, PVSC 2015., 7355874, Institute of Electrical and Electronics Engineers Inc., 42nd IEEE Photovoltaic Specialist Conference, PVSC 2015, New Orleans, United States, 6/14/15. https://doi.org/10.1109/PVSC.2015.7355874

@inproceedings{41768ee1bbf846babbd4e331b6b0e63b,

title = "Electroplated Al as the front electrode in crystalline-Si solar cells",

abstract = "This paper reports aluminum (Al) electroplating as the metallization technique for the front finger electrode on n-type silicon (Si) in crystalline-Si solar cells. The development of the Al electroplating process is motivated by the limited reserves of silver (Ag) on this planet and the industry-wide push to reduce Ag usage for cost control. The new metallization process consists of: 1) patterning the silicon nitride (SiNx) layer for front electrode; 2) depositing a nickel (Ni) seed layer into the opening; 3) electroplating self-aligned Al onto the Ni seed layer and 4) annealing the Al/Ni electrode in air at ∼200°C. This temperature is far below the typical firing temperatures for commercial Al pastes. The new metallization process has been integrated into commercial p-type monocrystalline Si solar cells from Hareon Solar. An all-Al Si solar cell, with an electroplated Al front electrode and a screen-printed Al back electrode, has been demonstrated. The cell has a size of 2.54×2.54 cm2, with efficiencies approaching 15% demonstrated.",

keywords = "aluminum, electroplating, metallization, silicon solar cell, silver",

author = "Sun, {Wen Cheng} and Haifeng Zhang and Laidong Wang and Tracy, {Clarence J.} and Meng Tao",

year = "2015",

month = dec,

day = "14",

doi = "10.1109/PVSC.2015.7355874",

language = "English (US)",

isbn = "9781479979448",

booktitle = "2015 IEEE 42nd Photovoltaic Specialist Conference, PVSC 2015",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "42nd IEEE Photovoltaic Specialist Conference, PVSC 2015 ; Conference date: 14-06-2015 Through 19-06-2015",

}

TY - GEN

T1 - Electroplated Al as the front electrode in crystalline-Si solar cells

AU - Sun, Wen Cheng

AU - Zhang, Haifeng

AU - Wang, Laidong

AU - Tracy, Clarence J.

AU - Tao, Meng

PY - 2015/12/14

Y1 - 2015/12/14

N2 - This paper reports aluminum (Al) electroplating as the metallization technique for the front finger electrode on n-type silicon (Si) in crystalline-Si solar cells. The development of the Al electroplating process is motivated by the limited reserves of silver (Ag) on this planet and the industry-wide push to reduce Ag usage for cost control. The new metallization process consists of: 1) patterning the silicon nitride (SiNx) layer for front electrode; 2) depositing a nickel (Ni) seed layer into the opening; 3) electroplating self-aligned Al onto the Ni seed layer and 4) annealing the Al/Ni electrode in air at ∼200°C. This temperature is far below the typical firing temperatures for commercial Al pastes. The new metallization process has been integrated into commercial p-type monocrystalline Si solar cells from Hareon Solar. An all-Al Si solar cell, with an electroplated Al front electrode and a screen-printed Al back electrode, has been demonstrated. The cell has a size of 2.54×2.54 cm2, with efficiencies approaching 15% demonstrated.

AB - This paper reports aluminum (Al) electroplating as the metallization technique for the front finger electrode on n-type silicon (Si) in crystalline-Si solar cells. The development of the Al electroplating process is motivated by the limited reserves of silver (Ag) on this planet and the industry-wide push to reduce Ag usage for cost control. The new metallization process consists of: 1) patterning the silicon nitride (SiNx) layer for front electrode; 2) depositing a nickel (Ni) seed layer into the opening; 3) electroplating self-aligned Al onto the Ni seed layer and 4) annealing the Al/Ni electrode in air at ∼200°C. This temperature is far below the typical firing temperatures for commercial Al pastes. The new metallization process has been integrated into commercial p-type monocrystalline Si solar cells from Hareon Solar. An all-Al Si solar cell, with an electroplated Al front electrode and a screen-printed Al back electrode, has been demonstrated. The cell has a size of 2.54×2.54 cm2, with efficiencies approaching 15% demonstrated.

KW - aluminum

KW - electroplating

KW - metallization

KW - silicon solar cell

KW - silver

UR - http://www.scopus.com/inward/record.url?scp=84961627816&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84961627816&partnerID=8YFLogxK

U2 - 10.1109/PVSC.2015.7355874

DO - 10.1109/PVSC.2015.7355874

M3 - Conference contribution

AN - SCOPUS:84961627816

SN - 9781479979448

BT - 2015 IEEE 42nd Photovoltaic Specialist Conference, PVSC 2015

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 42nd IEEE Photovoltaic Specialist Conference, PVSC 2015

Y2 - 14 June 2015 through 19 June 2015

ER -

Electroplated Al as the front electrode in crystalline-Si solar cells

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