Electromigration damage characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce solder joints by three-dimensional X-ray tomography and scanning electron microscopy

Physics & Astronomy

• electromigration 91%
• solders 86%
• tomography 61%
• damage 55%
• scanning electron microscopy 50%
• characterization 43%
• x rays 35%
• voids 33%
• mechanical shock 19%
• V grooves 17%
• microstructure 15%
• oxidation resistance 15%
• cerium 14%
• markers 14%
• ductility 12%
• imaging techniques 12%
• diffusivity 12%
• intermetallics 11%
• performance 11%
• rare earth elements 11%
• methodology 10%
• cathodes 10%
• current density 9%
• mechanical properties 8%
• products 8%
• matrices 7%
• temperature 3%

Engineering & Materials Science

• Electromigration 100%
• Soldering alloys 76%
• Tomography 75%
• X rays 70%
• Scanning electron microscopy 61%
• Cerium 18%
• Microstructure 17%
• Oxidation resistance 16%
• Rare earths 15%
• Intermetallics 13%
• Cathodes 12%
• Current density 12%
• Ductility 11%
• Imaging techniques 9%
• Mechanical properties 8%
• Testing 6%
• Temperature 5%
• Experiments 4%

Chemical Compounds

• Solder 96%
• X-Ray 47%
• Scanning Electron Microscopy 46%
• Alloy 27%
• Ductility 15%
• Cerium 12%
• Marker 11%
• Displacement 10%
• Current Density 9%
• Cathode 9%
• Microstructure 8%
• Resistance 8%
• Diffusion 8%
• Oxidation Reaction 5%