Effects of microstructure on spall damage localization in shock loaded copper multicrystals

S. Hashemian, S. Digiacomo, Pedro Peralta, H. D'Armas, S. N. Luo, E. Loomis, D. Paisley, D. Byler, R. Dickerson, K. J. McCllelan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Correlations between damage and local microstructure were investigated in multicrystalline copper samples via impact tests conducted with laser-driven plates at low pressures (2-6 GPA). The copper samples had a large grain size as compared to the thickness, which was either 200 or 1000 μm, to isolate the effects of microstructure on the local response. Velocity interferometry was used to measure the bulk response of the free-surface velocity of the samples to monitor spall tensile failure. Electron Backscattering Diffraction (EBSD), both in-plane and through-thickness, was used to relate crystallography to the presence of porosity around microstructural features such as grain boundaries and triple points. A transition between transgranular and intergranular damage was observed as the grain size was reduced from 230 μm to 150 μm in thin samples, whereas both modes were observed in thick specimens (450 μm grain size). Potential sites for preferred damage nucleation and strain localization were identified in terms of their crystallography via statistical sampling in serial sectioned specimens. Results indicate that grain boundaries with misorientation angles larger than 30° and close to triple and quadruple points are the preferred locations for intergranular damage localization in these samples.

Original languageEnglish (US)
Title of host publicationTMS Annual Meeting
Pages319-325
Number of pages7
Volume1
StatePublished - 2008
EventTMS 2008 Annual Meeting Supplemental: Materials Processing and Properties - New Orleans, LA, United States
Duration: Mar 9 2008Mar 13 2008

Other

OtherTMS 2008 Annual Meeting Supplemental: Materials Processing and Properties
CountryUnited States
CityNew Orleans, LA
Period3/9/083/13/08

Fingerprint

Crystallography
Copper
Grain boundaries
shock
damage
copper
microstructure
Microstructure
Backscattering
Interferometry
grain size
Nucleation
Porosity
Diffraction
crystallography
Sampling
grain boundaries
Electrons
Lasers
impact tests

Keywords

  • Crystallography
  • Damage nucleation
  • Grain size
  • Microstructure
  • Shock
  • Spall

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanics of Materials
  • Metals and Alloys

Cite this

Hashemian, S., Digiacomo, S., Peralta, P., D'Armas, H., Luo, S. N., Loomis, E., ... McCllelan, K. J. (2008). Effects of microstructure on spall damage localization in shock loaded copper multicrystals. In TMS Annual Meeting (Vol. 1, pp. 319-325)

Effects of microstructure on spall damage localization in shock loaded copper multicrystals. / Hashemian, S.; Digiacomo, S.; Peralta, Pedro; D'Armas, H.; Luo, S. N.; Loomis, E.; Paisley, D.; Byler, D.; Dickerson, R.; McCllelan, K. J.

TMS Annual Meeting. Vol. 1 2008. p. 319-325.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hashemian, S, Digiacomo, S, Peralta, P, D'Armas, H, Luo, SN, Loomis, E, Paisley, D, Byler, D, Dickerson, R & McCllelan, KJ 2008, Effects of microstructure on spall damage localization in shock loaded copper multicrystals. in TMS Annual Meeting. vol. 1, pp. 319-325, TMS 2008 Annual Meeting Supplemental: Materials Processing and Properties, New Orleans, LA, United States, 3/9/08.
Hashemian S, Digiacomo S, Peralta P, D'Armas H, Luo SN, Loomis E et al. Effects of microstructure on spall damage localization in shock loaded copper multicrystals. In TMS Annual Meeting. Vol. 1. 2008. p. 319-325
Hashemian, S. ; Digiacomo, S. ; Peralta, Pedro ; D'Armas, H. ; Luo, S. N. ; Loomis, E. ; Paisley, D. ; Byler, D. ; Dickerson, R. ; McCllelan, K. J. / Effects of microstructure on spall damage localization in shock loaded copper multicrystals. TMS Annual Meeting. Vol. 1 2008. pp. 319-325
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AU - Paisley, D.

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AB - Correlations between damage and local microstructure were investigated in multicrystalline copper samples via impact tests conducted with laser-driven plates at low pressures (2-6 GPA). The copper samples had a large grain size as compared to the thickness, which was either 200 or 1000 μm, to isolate the effects of microstructure on the local response. Velocity interferometry was used to measure the bulk response of the free-surface velocity of the samples to monitor spall tensile failure. Electron Backscattering Diffraction (EBSD), both in-plane and through-thickness, was used to relate crystallography to the presence of porosity around microstructural features such as grain boundaries and triple points. A transition between transgranular and intergranular damage was observed as the grain size was reduced from 230 μm to 150 μm in thin samples, whereas both modes were observed in thick specimens (450 μm grain size). Potential sites for preferred damage nucleation and strain localization were identified in terms of their crystallography via statistical sampling in serial sectioned specimens. Results indicate that grain boundaries with misorientation angles larger than 30° and close to triple and quadruple points are the preferred locations for intergranular damage localization in these samples.

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KW - Shock

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