Effects of microstructure on spall damage localization in shock loaded copper multicrystals

S. Hashemian, S. Digiacomo, Pedro Peralta, H. D'Armas, S. N. Luo, E. Loomis, D. Paisley, D. Byler, R. Dickerson, K. J. McCllelan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

Correlations between damage and local microstructure were investigated in multicrystalline copper samples via impact tests conducted with laser-driven plates at low pressures (2-6 GPA). The copper samples had a large grain size as compared to the thickness, which was either 200 or 1000 μm, to isolate the effects of microstructure on the local response. Velocity interferometry was used to measure the bulk response of the free-surface velocity of the samples to monitor spall tensile failure. Electron Backscattering Diffraction (EBSD), both in-plane and through-thickness, was used to relate crystallography to the presence of porosity around microstructural features such as grain boundaries and triple points. A transition between transgranular and intergranular damage was observed as the grain size was reduced from 230 μm to 150 μm in thin samples, whereas both modes were observed in thick specimens (450 μm grain size). Potential sites for preferred damage nucleation and strain localization were identified in terms of their crystallography via statistical sampling in serial sectioned specimens. Results indicate that grain boundaries with misorientation angles larger than 30° and close to triple and quadruple points are the preferred locations for intergranular damage localization in these samples.

Original languageEnglish (US)
Title of host publicationTMS2008 - 137th Annual Meeting and Exhibition Supplemental Proceedings
Subtitle of host publicationMaterials Processing and Properties
Pages319-325
Number of pages7
StatePublished - Oct 20 2008
EventTMS 2008 Annual Meeting Supplemental: Materials Processing and Properties - New Orleans, LA, United States
Duration: Mar 9 2008Mar 13 2008

Publication series

NameTMS Annual Meeting
Volume1

Other

OtherTMS 2008 Annual Meeting Supplemental: Materials Processing and Properties
CountryUnited States
CityNew Orleans, LA
Period3/9/083/13/08

Keywords

  • Crystallography
  • Damage nucleation
  • Grain size
  • Microstructure
  • Shock
  • Spall

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanics of Materials
  • Metals and Alloys

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    Hashemian, S., Digiacomo, S., Peralta, P., D'Armas, H., Luo, S. N., Loomis, E., Paisley, D., Byler, D., Dickerson, R., & McCllelan, K. J. (2008). Effects of microstructure on spall damage localization in shock loaded copper multicrystals. In TMS2008 - 137th Annual Meeting and Exhibition Supplemental Proceedings: Materials Processing and Properties (pp. 319-325). (TMS Annual Meeting; Vol. 1).