Direct fabrication of a-Si:H thin film transistor arrays on flexible substrates: Critical challenges and enabling solutions

S. M. O'Rourke, D. E. Loy, C. Moyer, E. J. Bawolek, S. K. Ageno, B. P. O'Brien, M. Marrs, D. Bottesch, J. Dailey, R. Naujokaitas, J. P. Kaminski, David Allee, S. M. Venugopal, J. Haq, Gregory Raupp

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Scopus citations

Abstract

In this paper we describe solutions to effectively address critical challenges in direct fabrication of amorphous silicon thin film transistor (TFTs) arrays for active matrix flexible displays. For both metal foil and plastic flexible substrates a manufacturable handling protocol in automated display-scale equipment is required. We have successfully demonstrated a temporary bonding protocol that required development of new enabling materials, tools and processes. For metal foil substrates, the principal challenges are planarization and electrical isolation, and management of stress (CTE mismatch) during TFT fabrication. For plastic substrates, the principal challenges are dimensional instability management in conjunction with manufacturing-ready temporary adhesives. Solutions required a systems-level approach to address the challenges of the substrates and their handling simultaneously.

Original languageEnglish (US)
Title of host publicationECS Transactions - Thin Film Transistors 9, TFT 9
Pages49-54
Number of pages6
Edition9
DOIs
StatePublished - Dec 1 2008
EventThin Film Transistors 9, TFT 9 - 214th ECS Meeting - Honolulu, HI, United States
Duration: Oct 13 2008Oct 16 2008

Publication series

NameECS Transactions
Number9
Volume16
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Other

OtherThin Film Transistors 9, TFT 9 - 214th ECS Meeting
CountryUnited States
CityHonolulu, HI
Period10/13/0810/16/08

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ASJC Scopus subject areas

  • Engineering(all)

Cite this

O'Rourke, S. M., Loy, D. E., Moyer, C., Bawolek, E. J., Ageno, S. K., O'Brien, B. P., Marrs, M., Bottesch, D., Dailey, J., Naujokaitas, R., Kaminski, J. P., Allee, D., Venugopal, S. M., Haq, J., & Raupp, G. (2008). Direct fabrication of a-Si:H thin film transistor arrays on flexible substrates: Critical challenges and enabling solutions. In ECS Transactions - Thin Film Transistors 9, TFT 9 (9 ed., pp. 49-54). (ECS Transactions; Vol. 16, No. 9). https://doi.org/10.1149/1.2980530