Constitutive behaviour of copper ribbons used in solar cell assembly processes

Steffen Wiese, Rico MEIER, Frank Kraemer, Joerg Bagdahn

Research output: Chapter in Book/Report/Conference proceedingConference contribution

21 Citations (Scopus)

Abstract

One of the driving factors for a steady reduction in wafer and cell thickness is the present shortage of polysilicon feedstock combined with the need to reduce manufacturing costs in photovoltaic module production. Therefore materials and manufacturing processes must adapt to maintain acceptable mechanical yields and module reliability. The soldering of solar cell strings is a critical step in the production of photovoltaic modules. Mechanical load and temperature induced stresses can cause cracking in the cells. During the soldering operation, the cell and the wires heat up and expand and then later contract when the heat is removed below the melting point of the solder. The differential contraction between the Cu and the Si combined with thermal gradients, cause stress to build up in the system. Since the solder thickness (5 ̇̇̇ 20 μm) is relatively small compared to thickness of the copper ribbon (100 ̇̇̇ 200 μm) and the thickness of the silicon solar cell (160 ̇̇̇ 200 μm), the constitutive behaviour of the copper ribbons is one of the key factors to reduce breakage after soldering of solar cells into strings.

Original languageEnglish (US)
Title of host publication2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009
DOIs
StatePublished - Jul 21 2009
Externally publishedYes
Event2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009 - Delft, Netherlands
Duration: Apr 26 2009Apr 29 2009

Other

Other2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009
CountryNetherlands
CityDelft
Period4/26/094/29/09

Fingerprint

Soldering
Solar cells
Copper
Soldering alloys
Silicon solar cells
Polysilicon
Thermal gradients
Feedstocks
Melting point
Loads (forces)
Cells
Wire
Costs
Temperature
Hot Temperature

ASJC Scopus subject areas

  • Computational Theory and Mathematics
  • Control and Systems Engineering
  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering

Cite this

Wiese, S., MEIER, R., Kraemer, F., & Bagdahn, J. (2009). Constitutive behaviour of copper ribbons used in solar cell assembly processes. In 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009 [4938464] https://doi.org/10.1109/ESIME.2009.4938464

Constitutive behaviour of copper ribbons used in solar cell assembly processes. / Wiese, Steffen; MEIER, Rico; Kraemer, Frank; Bagdahn, Joerg.

2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. 2009. 4938464.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Wiese, S, MEIER, R, Kraemer, F & Bagdahn, J 2009, Constitutive behaviour of copper ribbons used in solar cell assembly processes. in 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009., 4938464, 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009, Delft, Netherlands, 4/26/09. https://doi.org/10.1109/ESIME.2009.4938464
Wiese S, MEIER R, Kraemer F, Bagdahn J. Constitutive behaviour of copper ribbons used in solar cell assembly processes. In 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. 2009. 4938464 https://doi.org/10.1109/ESIME.2009.4938464
Wiese, Steffen ; MEIER, Rico ; Kraemer, Frank ; Bagdahn, Joerg. / Constitutive behaviour of copper ribbons used in solar cell assembly processes. 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. 2009.
@inproceedings{91343599fc044044a4ad9aed2416c5b4,
title = "Constitutive behaviour of copper ribbons used in solar cell assembly processes",
abstract = "One of the driving factors for a steady reduction in wafer and cell thickness is the present shortage of polysilicon feedstock combined with the need to reduce manufacturing costs in photovoltaic module production. Therefore materials and manufacturing processes must adapt to maintain acceptable mechanical yields and module reliability. The soldering of solar cell strings is a critical step in the production of photovoltaic modules. Mechanical load and temperature induced stresses can cause cracking in the cells. During the soldering operation, the cell and the wires heat up and expand and then later contract when the heat is removed below the melting point of the solder. The differential contraction between the Cu and the Si combined with thermal gradients, cause stress to build up in the system. Since the solder thickness (5 ̇̇̇ 20 μm) is relatively small compared to thickness of the copper ribbon (100 ̇̇̇ 200 μm) and the thickness of the silicon solar cell (160 ̇̇̇ 200 μm), the constitutive behaviour of the copper ribbons is one of the key factors to reduce breakage after soldering of solar cells into strings.",
author = "Steffen Wiese and Rico MEIER and Frank Kraemer and Joerg Bagdahn",
year = "2009",
month = "7",
day = "21",
doi = "10.1109/ESIME.2009.4938464",
language = "English (US)",
isbn = "9781424441617",
booktitle = "2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009",

}

TY - GEN

T1 - Constitutive behaviour of copper ribbons used in solar cell assembly processes

AU - Wiese, Steffen

AU - MEIER, Rico

AU - Kraemer, Frank

AU - Bagdahn, Joerg

PY - 2009/7/21

Y1 - 2009/7/21

N2 - One of the driving factors for a steady reduction in wafer and cell thickness is the present shortage of polysilicon feedstock combined with the need to reduce manufacturing costs in photovoltaic module production. Therefore materials and manufacturing processes must adapt to maintain acceptable mechanical yields and module reliability. The soldering of solar cell strings is a critical step in the production of photovoltaic modules. Mechanical load and temperature induced stresses can cause cracking in the cells. During the soldering operation, the cell and the wires heat up and expand and then later contract when the heat is removed below the melting point of the solder. The differential contraction between the Cu and the Si combined with thermal gradients, cause stress to build up in the system. Since the solder thickness (5 ̇̇̇ 20 μm) is relatively small compared to thickness of the copper ribbon (100 ̇̇̇ 200 μm) and the thickness of the silicon solar cell (160 ̇̇̇ 200 μm), the constitutive behaviour of the copper ribbons is one of the key factors to reduce breakage after soldering of solar cells into strings.

AB - One of the driving factors for a steady reduction in wafer and cell thickness is the present shortage of polysilicon feedstock combined with the need to reduce manufacturing costs in photovoltaic module production. Therefore materials and manufacturing processes must adapt to maintain acceptable mechanical yields and module reliability. The soldering of solar cell strings is a critical step in the production of photovoltaic modules. Mechanical load and temperature induced stresses can cause cracking in the cells. During the soldering operation, the cell and the wires heat up and expand and then later contract when the heat is removed below the melting point of the solder. The differential contraction between the Cu and the Si combined with thermal gradients, cause stress to build up in the system. Since the solder thickness (5 ̇̇̇ 20 μm) is relatively small compared to thickness of the copper ribbon (100 ̇̇̇ 200 μm) and the thickness of the silicon solar cell (160 ̇̇̇ 200 μm), the constitutive behaviour of the copper ribbons is one of the key factors to reduce breakage after soldering of solar cells into strings.

UR - http://www.scopus.com/inward/record.url?scp=67650548161&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=67650548161&partnerID=8YFLogxK

U2 - 10.1109/ESIME.2009.4938464

DO - 10.1109/ESIME.2009.4938464

M3 - Conference contribution

AN - SCOPUS:67650548161

SN - 9781424441617

BT - 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009

ER -