CMOS biosensor system for on-chip cell culture with read-out circuitry and microfluidic packaging

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A 1.5 mm × 3 mm CMOS chip with sensors for monitoring on-chip cell cultures has been designed. The chip is designed in a 0.5 μm CMOS process which has 3 metal layers and 2 poly layers and is a 5 volt process. The chip contains ion sensitive field effect transistors (ISFETs), as well as ISFETs with read-out circuitry, for monitoring the pH of solutions placed on top of the chip. Interdigitated electrode structures (IDESs) are made using the top metal of the process to be used for sensing cellular attachment and proliferation via impendence. IDES read-out circuits and IDES test structures are included. The chip also contains test amplifiers, bandgap reference test structures, and connections for post-processing. We designed the chip to accommodate packaging into an environment where it will be directly exposed to a cell culture environment. Specifically we designed the chip to have the incorporated sensors near the center of the chip allowing for connections made around the edge of the chip to be sealed off using an epoxy or similar material to prevent shorting. Preliminary electrical characterization results for our amplifier indicate a gain of 48 dB, a bandwidth of 1.65 kHz, and a common mode rejection ratio (CMRR) of 72 dB. We also present a packaging technique using a flexible pcb substrate.

Original languageEnglish (US)
Title of host publicationProceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS
Pages4990-4993
Number of pages4
DOIs
StatePublished - 2012
Event34th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS 2012 - San Diego, CA, United States
Duration: Aug 28 2012Sep 1 2012

Other

Other34th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS 2012
CountryUnited States
CitySan Diego, CA
Period8/28/129/1/12

Fingerprint

Microfluidics
Biosensing Techniques
Product Packaging
Cell culture
Biosensors
Ion sensitive field effect transistors
Packaging
Electrodes
Cell Culture Techniques
Metals
Ions
Monitoring
Sensors
Energy gap
Cell Proliferation
Bandwidth
Networks (circuits)
Substrates
Processing

ASJC Scopus subject areas

  • Computer Vision and Pattern Recognition
  • Signal Processing
  • Biomedical Engineering
  • Health Informatics

Cite this

Welch, D., & Blain Christen, J. (2012). CMOS biosensor system for on-chip cell culture with read-out circuitry and microfluidic packaging. In Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS (pp. 4990-4993). [6347113] https://doi.org/10.1109/EMBC.2012.6347113

CMOS biosensor system for on-chip cell culture with read-out circuitry and microfluidic packaging. / Welch, David; Blain Christen, Jennifer.

Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS. 2012. p. 4990-4993 6347113.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Welch, D & Blain Christen, J 2012, CMOS biosensor system for on-chip cell culture with read-out circuitry and microfluidic packaging. in Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS., 6347113, pp. 4990-4993, 34th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS 2012, San Diego, CA, United States, 8/28/12. https://doi.org/10.1109/EMBC.2012.6347113
Welch D, Blain Christen J. CMOS biosensor system for on-chip cell culture with read-out circuitry and microfluidic packaging. In Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS. 2012. p. 4990-4993. 6347113 https://doi.org/10.1109/EMBC.2012.6347113
Welch, David ; Blain Christen, Jennifer. / CMOS biosensor system for on-chip cell culture with read-out circuitry and microfluidic packaging. Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS. 2012. pp. 4990-4993
@inproceedings{597430fefe094beba39e21733ad732c3,
title = "CMOS biosensor system for on-chip cell culture with read-out circuitry and microfluidic packaging",
abstract = "A 1.5 mm × 3 mm CMOS chip with sensors for monitoring on-chip cell cultures has been designed. The chip is designed in a 0.5 μm CMOS process which has 3 metal layers and 2 poly layers and is a 5 volt process. The chip contains ion sensitive field effect transistors (ISFETs), as well as ISFETs with read-out circuitry, for monitoring the pH of solutions placed on top of the chip. Interdigitated electrode structures (IDESs) are made using the top metal of the process to be used for sensing cellular attachment and proliferation via impendence. IDES read-out circuits and IDES test structures are included. The chip also contains test amplifiers, bandgap reference test structures, and connections for post-processing. We designed the chip to accommodate packaging into an environment where it will be directly exposed to a cell culture environment. Specifically we designed the chip to have the incorporated sensors near the center of the chip allowing for connections made around the edge of the chip to be sealed off using an epoxy or similar material to prevent shorting. Preliminary electrical characterization results for our amplifier indicate a gain of 48 dB, a bandwidth of 1.65 kHz, and a common mode rejection ratio (CMRR) of 72 dB. We also present a packaging technique using a flexible pcb substrate.",
author = "David Welch and {Blain Christen}, Jennifer",
year = "2012",
doi = "10.1109/EMBC.2012.6347113",
language = "English (US)",
isbn = "9781424441198",
pages = "4990--4993",
booktitle = "Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS",

}

TY - GEN

T1 - CMOS biosensor system for on-chip cell culture with read-out circuitry and microfluidic packaging

AU - Welch, David

AU - Blain Christen, Jennifer

PY - 2012

Y1 - 2012

N2 - A 1.5 mm × 3 mm CMOS chip with sensors for monitoring on-chip cell cultures has been designed. The chip is designed in a 0.5 μm CMOS process which has 3 metal layers and 2 poly layers and is a 5 volt process. The chip contains ion sensitive field effect transistors (ISFETs), as well as ISFETs with read-out circuitry, for monitoring the pH of solutions placed on top of the chip. Interdigitated electrode structures (IDESs) are made using the top metal of the process to be used for sensing cellular attachment and proliferation via impendence. IDES read-out circuits and IDES test structures are included. The chip also contains test amplifiers, bandgap reference test structures, and connections for post-processing. We designed the chip to accommodate packaging into an environment where it will be directly exposed to a cell culture environment. Specifically we designed the chip to have the incorporated sensors near the center of the chip allowing for connections made around the edge of the chip to be sealed off using an epoxy or similar material to prevent shorting. Preliminary electrical characterization results for our amplifier indicate a gain of 48 dB, a bandwidth of 1.65 kHz, and a common mode rejection ratio (CMRR) of 72 dB. We also present a packaging technique using a flexible pcb substrate.

AB - A 1.5 mm × 3 mm CMOS chip with sensors for monitoring on-chip cell cultures has been designed. The chip is designed in a 0.5 μm CMOS process which has 3 metal layers and 2 poly layers and is a 5 volt process. The chip contains ion sensitive field effect transistors (ISFETs), as well as ISFETs with read-out circuitry, for monitoring the pH of solutions placed on top of the chip. Interdigitated electrode structures (IDESs) are made using the top metal of the process to be used for sensing cellular attachment and proliferation via impendence. IDES read-out circuits and IDES test structures are included. The chip also contains test amplifiers, bandgap reference test structures, and connections for post-processing. We designed the chip to accommodate packaging into an environment where it will be directly exposed to a cell culture environment. Specifically we designed the chip to have the incorporated sensors near the center of the chip allowing for connections made around the edge of the chip to be sealed off using an epoxy or similar material to prevent shorting. Preliminary electrical characterization results for our amplifier indicate a gain of 48 dB, a bandwidth of 1.65 kHz, and a common mode rejection ratio (CMRR) of 72 dB. We also present a packaging technique using a flexible pcb substrate.

UR - http://www.scopus.com/inward/record.url?scp=84870780815&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84870780815&partnerID=8YFLogxK

U2 - 10.1109/EMBC.2012.6347113

DO - 10.1109/EMBC.2012.6347113

M3 - Conference contribution

C2 - 23367048

SN - 9781424441198

SP - 4990

EP - 4993

BT - Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS

ER -