Characterization of thin photosensitive polyimide films for future metallization schemes

Terry Alford; Y. L. Zou; Kaustubh S. Gadre; N. David Theodore; W. Chen

doi:10.1116/1.1379797

Characterization of thin photosensitive polyimide films for future metallization schemes

Terry Alford, Y. L. Zou, Kaustubh S. Gadre, N. David Theodore, W. Chen

Chemical Engineering

Research output: Contribution to journal › Conference article › peer-review

2 Scopus citations

Abstract

PSPI was characterized to determine thermal, mechanical, and morphological properties. It was found to possess excellent thermal stability characterized by a thermal decomposition temperature of 450°C and an average thermal expansion coefficient of 20×10^-6/°C. The dielectric constants were 3.0 in the in-plane and 2.6 in the out-of-plane directions.

Original language	English (US)
Pages (from-to)	1253-1258
Number of pages	6
Journal	Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume	19
Issue number	4
DOIs	https://doi.org/10.1116/1.1379797
State	Published - Jul 2001
Event	19th North American Conference on Molecular Beam Epitaxy (NAMBE-19) - Tempe, AZ, United States Duration: Oct 15 2000 → Oct 18 2000

ASJC Scopus subject areas

Condensed Matter Physics
Electrical and Electronic Engineering

Access to Document

10.1116/1.1379797

Cite this

@article{81dc9b5e1a9d443986459dba18dc95a0,

title = "Characterization of thin photosensitive polyimide films for future metallization schemes",

abstract = "PSPI was characterized to determine thermal, mechanical, and morphological properties. It was found to possess excellent thermal stability characterized by a thermal decomposition temperature of 450°C and an average thermal expansion coefficient of 20×10-6/°C. The dielectric constants were 3.0 in the in-plane and 2.6 in the out-of-plane directions.",

author = "Terry Alford and Zou, {Y. L.} and Gadre, {Kaustubh S.} and {David Theodore}, N. and W. Chen",

year = "2001",

month = jul,

doi = "10.1116/1.1379797",

language = "English (US)",

volume = "19",

pages = "1253--1258",

journal = "Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures",

issn = "1071-1023",

publisher = "AVS Science and Technology Society",

number = "4",

note = "19th North American Conference on Molecular Beam Epitaxy (NAMBE-19) ; Conference date: 15-10-2000 Through 18-10-2000",

}

TY - JOUR

T1 - Characterization of thin photosensitive polyimide films for future metallization schemes

AU - Alford, Terry

AU - Zou, Y. L.

AU - Gadre, Kaustubh S.

AU - David Theodore, N.

AU - Chen, W.

PY - 2001/7

Y1 - 2001/7

N2 - PSPI was characterized to determine thermal, mechanical, and morphological properties. It was found to possess excellent thermal stability characterized by a thermal decomposition temperature of 450°C and an average thermal expansion coefficient of 20×10-6/°C. The dielectric constants were 3.0 in the in-plane and 2.6 in the out-of-plane directions.

AB - PSPI was characterized to determine thermal, mechanical, and morphological properties. It was found to possess excellent thermal stability characterized by a thermal decomposition temperature of 450°C and an average thermal expansion coefficient of 20×10-6/°C. The dielectric constants were 3.0 in the in-plane and 2.6 in the out-of-plane directions.

UR - http://www.scopus.com/inward/record.url?scp=0035535256&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0035535256&partnerID=8YFLogxK

U2 - 10.1116/1.1379797

DO - 10.1116/1.1379797

M3 - Conference article

AN - SCOPUS:0035535256

SN - 1071-1023

VL - 19

SP - 1253

EP - 1258

JO - Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

JF - Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

IS - 4

T2 - 19th North American Conference on Molecular Beam Epitaxy (NAMBE-19)

Y2 - 15 October 2000 through 18 October 2000

ER -

Characterization of thin photosensitive polyimide films for future metallization schemes

Abstract

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this