Characterization of stacking fault-induced behavior in 4H-SiC p-i-n diodes

Y. Wang, L. Chen, M. K. Mikhov, G. Samson, Brian Skromme

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

Formation of Il Shockley stacking faults by recombination- enhanced defect glide in 4HSiC p-i-n diodes subject to high forward current stress is studied in diodes on both c-oriented and aoriented substrates. The forward voltage increases during stressing for both orientations, accompanied by nucleation and expansion of faults visible in electroluminescence (EL) imaging. Low temperature photoluminescence (PL) measurements on degraded diodes of both orientations reveal the same set of exciton peaks, confirming that the electronic structure of the faults is the same in both cases. The spectroscopic data are compared to self-consistent solutions of the Schrödinger and Poisson equations including polarization charge. Dislocations nucleating the faults are bright in EL images but dark in electron beam-induced current (EBIC) imaging, confirming that they are sites of enhanced radiative recombination.

Original languageEnglish (US)
Title of host publicationSilicon Carbide and Related Materials 2005, - Proceedings of the International Conference on Silicon Carbide and Related Materials 2005
PublisherTrans Tech Publications Ltd
Pages363-366
Number of pages4
EditionPART 1
ISBN (Print)9780878494255
DOIs
StatePublished - 2006
EventInternational Conference on Silicon Carbide and Related Materials 2005, (ICSCRM 2005) - Pittsburgh, PA, United States
Duration: Sep 18 2005Sep 23 2005

Publication series

NameMaterials Science Forum
NumberPART 1
Volume527-529
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Other

OtherInternational Conference on Silicon Carbide and Related Materials 2005, (ICSCRM 2005)
Country/TerritoryUnited States
CityPittsburgh, PA
Period9/18/059/23/05

Keywords

  • 4H-SiC
  • EBIC
  • Electroluminescence
  • P-i-n diode
  • Photoluminescence
  • Stacking fault

ASJC Scopus subject areas

  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Fingerprint

Dive into the research topics of 'Characterization of stacking fault-induced behavior in 4H-SiC p-i-n diodes'. Together they form a unique fingerprint.

Cite this