TY - GEN
T1 - Automation and yield of micron-scale self-assembly processes
AU - Saeedi, Ehsan
AU - Kim, Samuel S.
AU - Etzkorn, James R.
AU - Meldrum, Deirdre
AU - Parviz, Babak A.
PY - 2007/12/1
Y1 - 2007/12/1
N2 - We present the use of self-assembly to integrate a large number of free-standing microcomponents onto unconventional substrates. The microcomponents are batch fabricated separately from different semiconductor materials in potentially incompatible microfabrication processes and integrated onto unconventional substrates such as glass and plastic. These substrates offer a number of unique attributes as compared with silicon such as transparency, flexibility, and lower cost. Here, we provide an overview of the self-assembly process, describe how microcomponents that can participate in the self-assembly process can be mass-produced, and discuss initial self-assembly experimental results. Our results indicate that even with a very simple set-up, self-assembly yields as high as 97% for components as small as 100 μm are achievable, making the self-assembly technique immediately comparable with (or better than) the state-of-the-art robotic pick-and-place systems. We discuss various parameters that affect the yield of the self-assembly process and a possible automation scheme.
AB - We present the use of self-assembly to integrate a large number of free-standing microcomponents onto unconventional substrates. The microcomponents are batch fabricated separately from different semiconductor materials in potentially incompatible microfabrication processes and integrated onto unconventional substrates such as glass and plastic. These substrates offer a number of unique attributes as compared with silicon such as transparency, flexibility, and lower cost. Here, we provide an overview of the self-assembly process, describe how microcomponents that can participate in the self-assembly process can be mass-produced, and discuss initial self-assembly experimental results. Our results indicate that even with a very simple set-up, self-assembly yields as high as 97% for components as small as 100 μm are achievable, making the self-assembly technique immediately comparable with (or better than) the state-of-the-art robotic pick-and-place systems. We discuss various parameters that affect the yield of the self-assembly process and a possible automation scheme.
UR - http://www.scopus.com/inward/record.url?scp=44449117600&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=44449117600&partnerID=8YFLogxK
U2 - 10.1109/COASE.2007.4341776
DO - 10.1109/COASE.2007.4341776
M3 - Conference contribution
AN - SCOPUS:44449117600
SN - 1424411548
SN - 9781424411542
T3 - Proceedings of the 3rd IEEE International Conference on Automation Science and Engineering, IEEE CASE 2007
SP - 375
EP - 380
BT - Proceedings of the 3rd IEEE International Conference on Automation Science and Engineering, IEEE CASE 2007
T2 - 3rd IEEE International Conference on Automation Science and Engineering, IEEE CASE 2007
Y2 - 22 September 2007 through 25 September 2007
ER -