Abstract
This paper describes transmission-line structures for optoelectronic integrated circuits (OEICs) and monolithic microwave integrated circuits (MMICs) using glass processing assisted microbump bonding (GPAMBB). Two different configurations of air-gap transmission lines are fabricated using this interconnection technique. Because the field distributions are mainly in air, these structures have the advantages of low losses, and low dispersion. Theoretical and experimental results of both structures are presented in this paper. The attenuation of the two air-gap transmission lines and the conventional CPW are compared over the 2 GHz - 20 GHz range.
| Original language | English (US) |
|---|---|
| Title of host publication | IEEE MTT-S International Microwave Symposium Digest |
| Editors | G.A. Koepf |
| Publisher | IEEE |
| Pages | 265-268 |
| Number of pages | 4 |
| Volume | 1 |
| State | Published - 1997 |
| Event | Proceedings of the 1997 IEEE MTT-S International Microwave Symposium. Part 1 (of 3) - Denver, CO, USA Duration: Jun 8 1997 → Jun 13 1997 |
Other
| Other | Proceedings of the 1997 IEEE MTT-S International Microwave Symposium. Part 1 (of 3) |
|---|---|
| City | Denver, CO, USA |
| Period | 6/8/97 → 6/13/97 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Condensed Matter Physics