Air-gap transmission lines for OEICs and MMICs using glass substrates

J. Chuang, S. M. El-Ghazaly, D. K. Schroder, Yong-Hang Zhang, G. N. Maracas, A. C. Reyes

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Abstract

This paper describes transmission-line structures for optoelectronic integrated circuits (OEICs) and monolithic microwave integrated circuits (MMICs) using glass processing assisted microbump bonding (GPAMBB). Two different configurations of air-gap transmission lines are fabricated using this interconnection technique. Because the field distributions are mainly in air, these structures have the advantages of low losses, and low dispersion. Theoretical and experimental results of both structures are presented in this paper. The attenuation of the two air-gap transmission lines and the conventional CPW are compared over the 2 GHz - 20 GHz range.

Original languageEnglish (US)
Title of host publicationIEEE MTT-S International Microwave Symposium Digest
EditorsG.A. Koepf
PublisherIEEE
Pages265-268
Number of pages4
Volume1
StatePublished - 1997
EventProceedings of the 1997 IEEE MTT-S International Microwave Symposium. Part 1 (of 3) - Denver, CO, USA
Duration: Jun 8 1997Jun 13 1997

Other

OtherProceedings of the 1997 IEEE MTT-S International Microwave Symposium. Part 1 (of 3)
CityDenver, CO, USA
Period6/8/976/13/97

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

Chuang, J., El-Ghazaly, S. M., Schroder, D. K., Zhang, Y-H., Maracas, G. N., & Reyes, A. C. (1997). Air-gap transmission lines for OEICs and MMICs using glass substrates. In G. A. Koepf (Ed.), IEEE MTT-S International Microwave Symposium Digest (Vol. 1, pp. 265-268). IEEE.