TY - GEN
T1 - A review of convective heat transfer with nanofluids for electronics packaging
AU - Lai, W. Y.
AU - Duculescu, B.
AU - Phelan, Patrick
AU - Prasher, Ravi
PY - 2006
Y1 - 2006
N2 - Nanofluids are conventional heat transfer liquids, such as water or glycol mixtures, which contain a small volume fraction of suspended nanoparticles in a colloidal solution. Numerous experiments on the static thermal conductivity of these fluids have revealed a greater-than-expected effective thermal conductivity, and thus there is great interest in utilizing nanofluids for heat transfer applications. For electronic packaging, their thermal performance under convective heat transfer conditions is of greatest interest. Therefore, we report here a critical review of the limited existing data on convective heat transfer with nanofluids. The results indicate higher Nusselt numbers than those predicted from analytical expressions at low Reynolds numbers, or by the Dittus-Boelter correlation at higher Reynolds numbers. Based on these findings, the applicability of convective heat sinks containing nanofluids are promising for electronics packaging applications.
AB - Nanofluids are conventional heat transfer liquids, such as water or glycol mixtures, which contain a small volume fraction of suspended nanoparticles in a colloidal solution. Numerous experiments on the static thermal conductivity of these fluids have revealed a greater-than-expected effective thermal conductivity, and thus there is great interest in utilizing nanofluids for heat transfer applications. For electronic packaging, their thermal performance under convective heat transfer conditions is of greatest interest. Therefore, we report here a critical review of the limited existing data on convective heat transfer with nanofluids. The results indicate higher Nusselt numbers than those predicted from analytical expressions at low Reynolds numbers, or by the Dittus-Boelter correlation at higher Reynolds numbers. Based on these findings, the applicability of convective heat sinks containing nanofluids are promising for electronics packaging applications.
KW - Convection
KW - Electronic packaging
KW - Nanofluid
UR - http://www.scopus.com/inward/record.url?scp=33845586305&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=33845586305&partnerID=8YFLogxK
U2 - 10.1109/ITHERM.2006.1645487
DO - 10.1109/ITHERM.2006.1645487
M3 - Conference contribution
AN - SCOPUS:33845586305
SN - 0780395247
SN - 9780780395244
T3 - Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
SP - 1240
EP - 1244
BT - Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006
T2 - 10th Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006
Y2 - 30 May 2006 through 2 June 2006
ER -