Engineering & Materials Science
Soldering alloys
100%
Intermetallics
63%
3D printers
56%
Powders
55%
Copper
46%
Lead-free solders
45%
Interdiffusion (solids)
43%
Fatigue of materials
39%
Anisotropy
38%
Melting
36%
Carbon nanotubes
34%
Lasers
33%
Temperature
33%
Nanoindentation
32%
Durability
31%
Microelectronics
31%
Plastics
29%
Fatigue damage
28%
Microstructure
25%
Abutments (bridge)
24%
Electron beams
23%
Metals
22%
Ball grid arrays
22%
Ultrasonics
22%
Fusion reactions
22%
Electron beam melting
22%
Laser beams
21%
Liquids
21%
Finite element method
20%
Strain rate
20%
Mechanical properties
19%
Experiments
18%
Defects
17%
Electron diffraction
17%
Grain growth
17%
Crack initiation
17%
Hot Temperature
17%
Plasticity
17%
Molecular dynamics
16%
Geometry
16%
Piles
16%
Silicon
16%
Cracks
15%
Crystals
15%
Creep
15%
Elastic moduli
15%
Thermal cycling
15%
Crack propagation
14%
Yield stress
14%
Three dimensional integrated circuits
14%
Chemical Compounds
Solder
80%
Grain Size
46%
Additive
34%
Strength
34%
Alloy
34%
Microstructure
27%
Anisotropy
26%
Simulation
24%
Melting
23%
Electron Beam Melting
22%
Intermetallic Compound
21%
Microelectronics
21%
Strain
19%
Carbon Nanotube
18%
Thermomechanical Fatigue
18%
Electron Backscatter Diffraction
17%
Electron Beam
16%
Crack Initiation
16%
Plastic Property
15%
Grain Growth
15%
Soldering
15%
Metal
15%
Energy
14%
Ductility
14%
Interdiffusion
13%
Creep
13%
Crack Propagation
13%
Yield Point
12%
Aluminium Alloy
12%
Thermal Cycling
12%
Mechanical Fatigue
11%
Volume
10%
Shear
10%
Nanotube
10%
Solidification
9%
Shear Stress
9%
Size Distribution
9%
Grain Boundary
9%
Composite Material
8%
Application
8%
Heat
8%
Surface Roughness
8%
Size Effect
8%
Fracture Toughness
8%
Plastic Deformation
8%
Wave
8%
Strain Hardening
7%
Molecular Dynamics
7%
Liquid
7%
Porosity
7%
Physics & Astronomy
solders
24%
intermetallics
20%
grain size
18%
plastic properties
16%
nanoindentation
12%
anisotropy
11%
strain rate
11%
microstructure
11%
integrated circuits
9%
microelectronics
9%
manufacturing
9%
microbalances
8%
multiscale models
7%
copper
7%
characterization
7%
peeling
7%
miniaturization
7%
mechanical properties
6%
artificial intelligence
6%
structural design
5%
acoustic scattering
5%
beds
5%
machine learning
5%
carbon nanotubes
5%
shear stress
5%
stress analysis
5%
crystals
5%