Fingerprint Fingerprint is based on mining the text of the persons scientific documents to create an index of weighted terms, which defines the key subjects of each individual researcher.

  • 1 Similar Profiles
Stress corrosion cracking Engineering & Materials Science
Corrosion Engineering & Materials Science
Cracks Engineering & Materials Science
Metals Chemical Compounds
Dissolution Engineering & Materials Science
stress corrosion cracking Physics & Astronomy
Copper Chemical Compounds
Hydrogen embrittlement Engineering & Materials Science

Network Recent external collaboration on country level. Dive into details by clicking on the dots.

Research Output 1900 2018

  • 7530 Citations
  • 44 h-Index
  • 121 Article
  • 23 Conference contribution
  • 2 Chapter
  • 1 Patent
3 Citations

Dealloyed nanoporous materials with interface-controlled behavior

Weissmüller, J. & Sieradzki, K. Jan 1 2018 In : MRS Bulletin. 43, 1, p. 14-19 6 p.

Research output: Contribution to journalArticle

Xerogels
Nanostructures
corrosion
elastic properties
Porosity
1 Citations

Dealloying at high homologous temperature: Morphology diagrams

Geng, K. & Sieradzki, K. Jan 1 2017 In : Journal of the Electrochemical Society. 164, 6, p. C330-C337

Research output: Contribution to journalArticle

Temperature
Chemical analysis
Titration
Gold
Dissolution
1 Citations

Effects of acetic acid, tartaric acid and Pb UPD on Cu electrodeposition in sub-micron trenches

Pounds, T., Sieradzki, K., Erlebacher, J. & Cammarata, R. C. Jan 1 2017 In : Journal of the Electrochemical Society. 164, 6, p. D307-D314

Research output: Contribution to journalArticle

Electrodeposition
Acetic acid
Acetic Acid
Acids
Organic acids
15 Citations

Mechanical properties of nanoporous gold in tension

Badwe, N., Chen, X. & Sieradzki, K. May 1 2017 In : Acta Materialia. 129, p. 251-258 8 p.

Research output: Contribution to journalArticle

Ligaments
Gold
Mechanical properties
Weibull distribution
Tensile properties
3 Citations

Interfacial fracture strength and toughness of copper/epoxy-resin interfaces

Badwe, N., Mahajan, R. & Sieradzki, K. Jan 15 2016 In : Acta Materialia. 103, p. 512-518 7 p.

Research output: Contribution to journalArticle

Epoxy Resins
Epoxy resins
Fracture toughness
Copper
Energy release rate

Projects 1992 2020