Beomjin Kwon

Assistant Professor

  • 314 Citations
  • 10 h-Index
20102019
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Fingerprint Dive into the research topics where Beomjin Kwon is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

  • 2 Similar Profiles
Infrared radiation Engineering & Materials Science
Microchannels Engineering & Materials Science
Cooling Engineering & Materials Science
temperature effects Physics & Astronomy
heat transfer Physics & Astronomy
Tin Engineering & Materials Science
Thermoelectric equipment Engineering & Materials Science
Thin films Engineering & Materials Science

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Research Output 2010 2019

  • 314 Citations
  • 10 h-Index
  • 32 Article
  • 5 Conference contribution
  • 1 Review article

Additively manufactured impinging air jet cooler for high-power electronic devices

Kwon, B., Foulkes, T., Yang, T., Miljkovic, N. & King, W. P., May 2019, Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019. IEEE Computer Society, p. 941-945 5 p. 8757389. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; vol. 2019-May).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Power electronics
Air
Gallium nitride
Transistors
Cooling

Heat transfer enhancement of internal laminar flows using additively manufactured static mixers

Kwon, B., Liebenberg, L., Jacobi, A. M. & King, W. P., Jul 2019, In : International Journal of Heat and Mass Transfer. 137, p. 292-300 9 p.

Research output: Contribution to journalArticle

3D printers
laminar flow
Laminar flow
heat transfer
Heat transfer
1 Citation (Scopus)

High power density two-phase cooling in microchannel heat exchangers

Kwon, B., Maniscalco, N. I., Jacobi, A. M. & King, W. P., Feb 5 2019, In : Applied Thermal Engineering. 148, p. 1271-1277 7 p.

Research output: Contribution to journalArticle

Microchannels
Heat exchangers
Cooling
Refrigerants
Air

Optimization of Liquid Cooling MicroChannel in 3D IC using Complete Converging and Diverging Channel Models

Hwang, L. K., Kwon, B. & Wong, M. D. F., May 2019, Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019. IEEE Computer Society, p. 1197-1203 7 p. 8757254. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; vol. 2019-May).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Microchannels
Cooling
Liquids
Computer simulation
Heat resistance
36 Citations (Scopus)

3D printing of shape-conformable thermoelectric materials using all-inorganic Bi2Te3-based inks

Kim, F., Kwon, B., Eom, Y., Lee, J. E., Park, S., Jo, S., Park, S. H., Kim, B. S., Im, H. J., Lee, M. H., Min, T. S., Kim, K. T., Chae, H. G., King, W. P. & Son, J. S., Apr 1 2018, In : Nature Energy. 3, 4, p. 301-309 9 p.

Research output: Contribution to journalArticle

Ink
Printing
Thermoelectric energy conversion
3D printers
Geometry