Young's modulus of (Cu, Ag)-Sn intermetallics measured by nanoindentation

X. Deng, M. Koopman, Nikhilesh Chawla, K. K. Chawla

Research output: Contribution to journalArticle

140 Citations (Scopus)

Abstract

Reflow of Sn-rich solders on a Cu substrate results in the formation of several Cu-Sn and Ag-Sn intermetallics, which control the properties of the solder joint. Bulk measurement of physical properties, such as Young's modulus, is problematic and may be affected by porosity and undesired phases. In this paper, we report on the accurate and reliable Young's modulus values of Cu6Sn5, Cu3Sn, and Ag3Sn intermetallics, measured in situ in a solder joint by nanoindentation. The measured values for Cu6Sn5, Cu3Sn, and Ag3Sn, were 112.3 ± 5.0, 134.2 ± 6.7, and 78.9 ± 3.7 GPa, respectively. Comparison of these values with limited data in the literature was also conducted and is discussed.

Original languageEnglish (US)
Pages (from-to)240-243
Number of pages4
JournalMaterials Science and Engineering A
Volume364
Issue number1-2
DOIs
StatePublished - Jan 15 2004

Fingerprint

Nanoindentation
solders
nanoindentation
Soldering alloys
Intermetallics
intermetallics
modulus of elasticity
Elastic moduli
Physical properties
Porosity
physical properties
porosity
Substrates

Keywords

  • Intermetallic
  • Nanoindentation
  • Solder
  • Young's modulus

ASJC Scopus subject areas

  • Materials Science(all)

Cite this

Young's modulus of (Cu, Ag)-Sn intermetallics measured by nanoindentation. / Deng, X.; Koopman, M.; Chawla, Nikhilesh; Chawla, K. K.

In: Materials Science and Engineering A, Vol. 364, No. 1-2, 15.01.2004, p. 240-243.

Research output: Contribution to journalArticle

Deng, X. ; Koopman, M. ; Chawla, Nikhilesh ; Chawla, K. K. / Young's modulus of (Cu, Ag)-Sn intermetallics measured by nanoindentation. In: Materials Science and Engineering A. 2004 ; Vol. 364, No. 1-2. pp. 240-243.
@article{e3e208bc9fd941429216ae9f03e08637,
title = "Young's modulus of (Cu, Ag)-Sn intermetallics measured by nanoindentation",
abstract = "Reflow of Sn-rich solders on a Cu substrate results in the formation of several Cu-Sn and Ag-Sn intermetallics, which control the properties of the solder joint. Bulk measurement of physical properties, such as Young's modulus, is problematic and may be affected by porosity and undesired phases. In this paper, we report on the accurate and reliable Young's modulus values of Cu6Sn5, Cu3Sn, and Ag3Sn intermetallics, measured in situ in a solder joint by nanoindentation. The measured values for Cu6Sn5, Cu3Sn, and Ag3Sn, were 112.3 ± 5.0, 134.2 ± 6.7, and 78.9 ± 3.7 GPa, respectively. Comparison of these values with limited data in the literature was also conducted and is discussed.",
keywords = "Intermetallic, Nanoindentation, Solder, Young's modulus",
author = "X. Deng and M. Koopman and Nikhilesh Chawla and Chawla, {K. K.}",
year = "2004",
month = "1",
day = "15",
doi = "10.1016/j.msea.2003.08.032",
language = "English (US)",
volume = "364",
pages = "240--243",
journal = "Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing",
issn = "0921-5093",
publisher = "Elsevier BV",
number = "1-2",

}

TY - JOUR

T1 - Young's modulus of (Cu, Ag)-Sn intermetallics measured by nanoindentation

AU - Deng, X.

AU - Koopman, M.

AU - Chawla, Nikhilesh

AU - Chawla, K. K.

PY - 2004/1/15

Y1 - 2004/1/15

N2 - Reflow of Sn-rich solders on a Cu substrate results in the formation of several Cu-Sn and Ag-Sn intermetallics, which control the properties of the solder joint. Bulk measurement of physical properties, such as Young's modulus, is problematic and may be affected by porosity and undesired phases. In this paper, we report on the accurate and reliable Young's modulus values of Cu6Sn5, Cu3Sn, and Ag3Sn intermetallics, measured in situ in a solder joint by nanoindentation. The measured values for Cu6Sn5, Cu3Sn, and Ag3Sn, were 112.3 ± 5.0, 134.2 ± 6.7, and 78.9 ± 3.7 GPa, respectively. Comparison of these values with limited data in the literature was also conducted and is discussed.

AB - Reflow of Sn-rich solders on a Cu substrate results in the formation of several Cu-Sn and Ag-Sn intermetallics, which control the properties of the solder joint. Bulk measurement of physical properties, such as Young's modulus, is problematic and may be affected by porosity and undesired phases. In this paper, we report on the accurate and reliable Young's modulus values of Cu6Sn5, Cu3Sn, and Ag3Sn intermetallics, measured in situ in a solder joint by nanoindentation. The measured values for Cu6Sn5, Cu3Sn, and Ag3Sn, were 112.3 ± 5.0, 134.2 ± 6.7, and 78.9 ± 3.7 GPa, respectively. Comparison of these values with limited data in the literature was also conducted and is discussed.

KW - Intermetallic

KW - Nanoindentation

KW - Solder

KW - Young's modulus

UR - http://www.scopus.com/inward/record.url?scp=0742287928&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0742287928&partnerID=8YFLogxK

U2 - 10.1016/j.msea.2003.08.032

DO - 10.1016/j.msea.2003.08.032

M3 - Article

AN - SCOPUS:0742287928

VL - 364

SP - 240

EP - 243

JO - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing

JF - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing

SN - 0921-5093

IS - 1-2

ER -