X-Ray Microtomography of Thermal Cycling Damage in Sintered Nano-Silver Solder Joints

Irene Lujan Regalado, Jason J. Williams, Shailesh Joshi, Ercan M. Dede, Yanghe Liu, Nikhilesh Chawla

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Novel high operating temperature thermal interface materials (TIMs) in power electronics are required to realize performance gains from the use of wide band-gap (WBG) semiconductor devices, such as Silicon Carbide (SiC) or Gallium Nitride (GaN). Additionally, the anticipated operating temperature of these devices is higher than 250 °C, preventing use of traditional solder material for packaging. The thermomechanical stresses induced inside the electronic package can severely degrade the reliability and life of the device. In this light, a new non-destructive approach is needed to understand damage mechanisms when subjected to reliability tests such as power and thermal cycling. In this work, a sintered nano-silver TIM is identified as a promising high temperature bonding candidate. Sintered nano-silver samples are fabricated and their shear strength values are reported. Thermal cycling tests are conducted and damage evolution is characterized using a lab scale three-dimensional (3D) X-ray system to periodically assess changes in the microstructure such as cracks, voids, and porosity in the TIM layer. The evolution of the microstructure and the effect of the cycling temperature profile during thermal cycling is discussed.

Original languageEnglish (US)
Article number1801029
JournalAdvanced Engineering Materials
DOIs
StateAccepted/In press - Jan 1 2019

Fingerprint

Thermal cycling
solders
Silver
Soldering alloys
silver
damage
operating temperature
X rays
cycles
thermal cycling tests
microstructure
x rays
gallium nitrides
shear strength
semiconductor devices
electronics
packaging
silicon carbides
temperature profiles
Gallium nitride

Keywords

  • die-attach
  • nano-Ag
  • nanoindentation
  • shear testing
  • sintering
  • thermal cycling
  • thermal interface materials (TIM)
  • x-ray tomography

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics

Cite this

X-Ray Microtomography of Thermal Cycling Damage in Sintered Nano-Silver Solder Joints. / Regalado, Irene Lujan; Williams, Jason J.; Joshi, Shailesh; Dede, Ercan M.; Liu, Yanghe; Chawla, Nikhilesh.

In: Advanced Engineering Materials, 01.01.2019.

Research output: Contribution to journalArticle

Regalado, Irene Lujan ; Williams, Jason J. ; Joshi, Shailesh ; Dede, Ercan M. ; Liu, Yanghe ; Chawla, Nikhilesh. / X-Ray Microtomography of Thermal Cycling Damage in Sintered Nano-Silver Solder Joints. In: Advanced Engineering Materials. 2019.
@article{f96c95172f0e4672b263aae3caa9495c,
title = "X-Ray Microtomography of Thermal Cycling Damage in Sintered Nano-Silver Solder Joints",
abstract = "Novel high operating temperature thermal interface materials (TIMs) in power electronics are required to realize performance gains from the use of wide band-gap (WBG) semiconductor devices, such as Silicon Carbide (SiC) or Gallium Nitride (GaN). Additionally, the anticipated operating temperature of these devices is higher than 250 °C, preventing use of traditional solder material for packaging. The thermomechanical stresses induced inside the electronic package can severely degrade the reliability and life of the device. In this light, a new non-destructive approach is needed to understand damage mechanisms when subjected to reliability tests such as power and thermal cycling. In this work, a sintered nano-silver TIM is identified as a promising high temperature bonding candidate. Sintered nano-silver samples are fabricated and their shear strength values are reported. Thermal cycling tests are conducted and damage evolution is characterized using a lab scale three-dimensional (3D) X-ray system to periodically assess changes in the microstructure such as cracks, voids, and porosity in the TIM layer. The evolution of the microstructure and the effect of the cycling temperature profile during thermal cycling is discussed.",
keywords = "die-attach, nano-Ag, nanoindentation, shear testing, sintering, thermal cycling, thermal interface materials (TIM), x-ray tomography",
author = "Regalado, {Irene Lujan} and Williams, {Jason J.} and Shailesh Joshi and Dede, {Ercan M.} and Yanghe Liu and Nikhilesh Chawla",
year = "2019",
month = "1",
day = "1",
doi = "10.1002/adem.201801029",
language = "English (US)",
journal = "Advanced Engineering Materials",
issn = "1438-1656",
publisher = "Wiley-VCH Verlag",

}

TY - JOUR

T1 - X-Ray Microtomography of Thermal Cycling Damage in Sintered Nano-Silver Solder Joints

AU - Regalado, Irene Lujan

AU - Williams, Jason J.

AU - Joshi, Shailesh

AU - Dede, Ercan M.

AU - Liu, Yanghe

AU - Chawla, Nikhilesh

PY - 2019/1/1

Y1 - 2019/1/1

N2 - Novel high operating temperature thermal interface materials (TIMs) in power electronics are required to realize performance gains from the use of wide band-gap (WBG) semiconductor devices, such as Silicon Carbide (SiC) or Gallium Nitride (GaN). Additionally, the anticipated operating temperature of these devices is higher than 250 °C, preventing use of traditional solder material for packaging. The thermomechanical stresses induced inside the electronic package can severely degrade the reliability and life of the device. In this light, a new non-destructive approach is needed to understand damage mechanisms when subjected to reliability tests such as power and thermal cycling. In this work, a sintered nano-silver TIM is identified as a promising high temperature bonding candidate. Sintered nano-silver samples are fabricated and their shear strength values are reported. Thermal cycling tests are conducted and damage evolution is characterized using a lab scale three-dimensional (3D) X-ray system to periodically assess changes in the microstructure such as cracks, voids, and porosity in the TIM layer. The evolution of the microstructure and the effect of the cycling temperature profile during thermal cycling is discussed.

AB - Novel high operating temperature thermal interface materials (TIMs) in power electronics are required to realize performance gains from the use of wide band-gap (WBG) semiconductor devices, such as Silicon Carbide (SiC) or Gallium Nitride (GaN). Additionally, the anticipated operating temperature of these devices is higher than 250 °C, preventing use of traditional solder material for packaging. The thermomechanical stresses induced inside the electronic package can severely degrade the reliability and life of the device. In this light, a new non-destructive approach is needed to understand damage mechanisms when subjected to reliability tests such as power and thermal cycling. In this work, a sintered nano-silver TIM is identified as a promising high temperature bonding candidate. Sintered nano-silver samples are fabricated and their shear strength values are reported. Thermal cycling tests are conducted and damage evolution is characterized using a lab scale three-dimensional (3D) X-ray system to periodically assess changes in the microstructure such as cracks, voids, and porosity in the TIM layer. The evolution of the microstructure and the effect of the cycling temperature profile during thermal cycling is discussed.

KW - die-attach

KW - nano-Ag

KW - nanoindentation

KW - shear testing

KW - sintering

KW - thermal cycling

KW - thermal interface materials (TIM)

KW - x-ray tomography

UR - http://www.scopus.com/inward/record.url?scp=85060127392&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85060127392&partnerID=8YFLogxK

U2 - 10.1002/adem.201801029

DO - 10.1002/adem.201801029

M3 - Article

JO - Advanced Engineering Materials

JF - Advanced Engineering Materials

SN - 1438-1656

M1 - 1801029

ER -